Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces

Takahiro Kagami, Hiroki Matsutani, Michihiro Koibuchi, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)

Abstract

Wireless 3-D network-on-chips (NoCs) with inductive-coupling ThruChip interfaces provide a large degree of flexibility for customizing the number of arbitrary chips in a package after chips have been fabricated. To simplify the vertical communication interfaces, static time division multiple access (TDMA) is used for the vertical broadcast buses, while arbitrary or customized topologies can be used for the intrachip network. This paper proposes two techniques to break through the simple static TDMA-based vertical buses while maintaining a simple communication interface. The first technique is headfirst sliding (HS) routing to reduce the waiting time for acquiring the communication time-slot. HS routing selects the best vertical bus based on the current time, taking advantage of static TDMA. The second technique extends carrier sense multiple access with collision detection (CSMA/CD) for vertical broadcast buses. We introduce a packet collision detection technique for inductive-coupling buses and propose two retransmission strategies to reduce the waiting time for packet retransmissions caused by collisions. Network simulation results show that HS routing reduces the communication latency by 39.1% compared with the conventional static TDMA bus-based 3-D NoC that uses the shortest path routing. The proposed CSMA/CD bus also improves the latency by 52.5% and throughput by 34.1%. The full-system simulation results show that HS routing and the proposed CSMA/CD technique reduce the application execution time accordingly while maintaining the average flit transfer energy overhead modest.

Original languageEnglish
Article number7086053
Pages (from-to)493-506
Number of pages14
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Volume24
Issue number2
DOIs
Publication statusPublished - 2016 Feb

Keywords

  • 3-D integration
  • ThruChip interface (TCI).
  • inductive-coupling
  • interconnection network
  • network-on-chip (NoC)

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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