Elastic-plastic analyses for surface cracked plates under combined bending and tension

Y. J. Kim, D. J. Shim, J. B. Choi, Yun Jae Kim

Research output: Contribution to journalArticle

20 Citations (Scopus)

Abstract

This paper provides an engineering J estimation equation for surface cracked plates under combined bending and tension. The proposed equation is based on the reference stress approach, and the most relevant normalizing loads to define the reference stress for accurate J estimations are given for surface cracked plates under combined bending and tension. Comparisons with J results from extensive three-dimensional finite element (FE) analyses, covering a wide range of crack geometry, plate geometry and loading combination, show overall good agreement not only at the deepest point but also at arbitrary points along the crack front, For pure tension, agreement between the estimated J values and the FE results is excellent, even at the surface point. On the other hand, for pure bending and combined bending and tension, the estimated J values become less accurate for locations close to the surface point.

Original languageEnglish
Pages (from-to)33-46
Number of pages14
JournalJournal of Strain Analysis for Engineering Design
Volume37
Issue number1
DOIs
Publication statusPublished - 2002 Jan 1
Externally publishedYes

Fingerprint

Plastics
Crack
Finite Element
Cracks
Geometry
Loads (forces)
Covering
Engineering
Three-dimensional
Arbitrary
Range of data

Keywords

  • Combined loading
  • Finite element
  • J-integral
  • Limit load
  • Reference stress method
  • Surface cracked plate

ASJC Scopus subject areas

  • Modelling and Simulation
  • Mechanics of Materials
  • Mechanical Engineering
  • Applied Mathematics

Cite this

Elastic-plastic analyses for surface cracked plates under combined bending and tension. / Kim, Y. J.; Shim, D. J.; Choi, J. B.; Kim, Yun Jae.

In: Journal of Strain Analysis for Engineering Design, Vol. 37, No. 1, 01.01.2002, p. 33-46.

Research output: Contribution to journalArticle

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