Electroencephalogram measurement from the hairy part of the scalp using polymer-based dry microneedle electrodes

M. Arai, Y. Kudo, Norihisa Miki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper reports a successful electroencephalogram (EEG) measurement from the hairy part of the scalp using a polymer-based dry microneedle electrode. The electrode consists of 25 pillars, each of which has a sharp microneedle on the top. Hairs are collected into the gaps of the pillars and the microneedles can reach the scalp surface. Since the microneedles can penetrate through the stratum corneum, no conductive gel is necessary to acquire high quality EEG. We experimentally investigated the pillar diameters in EEG measurement from the occipital region with hairs. The fabricated electrodes successfully measured EEG without any skin preparation or conductive gel.

Original languageEnglish
Title of host publicationProceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3165-3168
Number of pages4
Volume2015-November
ISBN (Print)9781424492718
DOIs
Publication statusPublished - 2015 Nov 4
Event37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2015 - Milan, Italy
Duration: 2015 Aug 252015 Aug 29

Other

Other37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2015
CountryItaly
CityMilan
Period15/8/2515/8/29

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ASJC Scopus subject areas

  • Computer Vision and Pattern Recognition
  • Signal Processing
  • Biomedical Engineering
  • Health Informatics

Cite this

Arai, M., Kudo, Y., & Miki, N. (2015). Electroencephalogram measurement from the hairy part of the scalp using polymer-based dry microneedle electrodes. In Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS (Vol. 2015-November, pp. 3165-3168). [7319064] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMBC.2015.7319064