Abstract
High-precision fabrication is indispensable for high-speed silicon micro-rotors for power MEMS applications so as to minimize the rotor imbalance that deteriorates the rotor performance. Etch variation of deep reactive ion etch (DRIE) process results in differences in rotor blade heights and thus rotor imbalance. A Fourier transform of the etch non-uniformity along the rotor circumference revealed the global etch variation across the wafer and local variations in etch rates depending on the concentration or proximity of the patterned geometry. Rotor imbalance arising from the global etch variation of DRIE process was estimated, which compared favorably to results obtained from spinning experiments. The global etch non-uniformity which culminates in rotor imbalance could be alleviated to 0.25% across a rotor of 4.2 mm diameter by optimizing the plasma chamber pressure. The developed DRIE recipe successfully reduced the rotor imbalance and thus enhanced the rotordynamic performance. The manufacturing processes presented herein are readily applicable to the construction of other microstructures containing intricate geometries and large etched areas.
| Original language | English |
|---|---|
| Pages (from-to) | 263-267 |
| Number of pages | 5 |
| Journal | Sensors and Actuators, A: Physical |
| Volume | 104 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 2003 May 15 |
| Externally published | Yes |
Fingerprint
Keywords
- Deep reactive ion etching
- Etch uniformity
- High-speed rotor
- Power MEMS
- Rotordynamics
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering
- Instrumentation
Cite this
Enhancement of rotordynamic performance of high-speed micro-rotors for power MEMS applications by precision deep reactive ion etching. / Miki, Norihisa; Teo, C. J.; Ho, L. C.; Zhang, X.
In: Sensors and Actuators, A: Physical, Vol. 104, No. 3, 15.05.2003, p. 263-267.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Enhancement of rotordynamic performance of high-speed micro-rotors for power MEMS applications by precision deep reactive ion etching
AU - Miki, Norihisa
AU - Teo, C. J.
AU - Ho, L. C.
AU - Zhang, X.
PY - 2003/5/15
Y1 - 2003/5/15
N2 - High-precision fabrication is indispensable for high-speed silicon micro-rotors for power MEMS applications so as to minimize the rotor imbalance that deteriorates the rotor performance. Etch variation of deep reactive ion etch (DRIE) process results in differences in rotor blade heights and thus rotor imbalance. A Fourier transform of the etch non-uniformity along the rotor circumference revealed the global etch variation across the wafer and local variations in etch rates depending on the concentration or proximity of the patterned geometry. Rotor imbalance arising from the global etch variation of DRIE process was estimated, which compared favorably to results obtained from spinning experiments. The global etch non-uniformity which culminates in rotor imbalance could be alleviated to 0.25% across a rotor of 4.2 mm diameter by optimizing the plasma chamber pressure. The developed DRIE recipe successfully reduced the rotor imbalance and thus enhanced the rotordynamic performance. The manufacturing processes presented herein are readily applicable to the construction of other microstructures containing intricate geometries and large etched areas.
AB - High-precision fabrication is indispensable for high-speed silicon micro-rotors for power MEMS applications so as to minimize the rotor imbalance that deteriorates the rotor performance. Etch variation of deep reactive ion etch (DRIE) process results in differences in rotor blade heights and thus rotor imbalance. A Fourier transform of the etch non-uniformity along the rotor circumference revealed the global etch variation across the wafer and local variations in etch rates depending on the concentration or proximity of the patterned geometry. Rotor imbalance arising from the global etch variation of DRIE process was estimated, which compared favorably to results obtained from spinning experiments. The global etch non-uniformity which culminates in rotor imbalance could be alleviated to 0.25% across a rotor of 4.2 mm diameter by optimizing the plasma chamber pressure. The developed DRIE recipe successfully reduced the rotor imbalance and thus enhanced the rotordynamic performance. The manufacturing processes presented herein are readily applicable to the construction of other microstructures containing intricate geometries and large etched areas.
KW - Deep reactive ion etching
KW - Etch uniformity
KW - High-speed rotor
KW - Power MEMS
KW - Rotordynamics
UR - http://www.scopus.com/inward/record.url?scp=0038054499&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0038054499&partnerID=8YFLogxK
U2 - 10.1016/S0924-4247(03)00028-1
DO - 10.1016/S0924-4247(03)00028-1
M3 - Article
AN - SCOPUS:0038054499
VL - 104
SP - 263
EP - 267
JO - Sensors and Actuators, A: Physical
JF - Sensors and Actuators, A: Physical
SN - 0924-4247
IS - 3
ER -