Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures

S. Kamiya, C. Chen, N. Shishido, Masaki Omiya, K. Koiwa, H. Sato, M. Nishida, T. Suzuki, T. Nakamura, T. Nokuo, T. Suzuki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Local apparent strength of interface between copper and cap layer on top was diverse depending on the crystal orientation underneath. For a comprehension of this diversity, physical adhesion energy to separate the interface was evaluated. It essentially does not include mechanical energy dissipating in plastic deformation in the process of crack extension. Sub-micron scale torsion test for elastic-plastic deformation properties and fracture tests on a number of different crystal orientations revealed that difference in adhesion energy is much smaller than difference in plastic dissipation energy. It is highly likely that small difference in the former is intensified through the latter, leading to a huge scatter in strength of LSI interconnect structures.

Original languageEnglish
Title of host publication2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages151-153
Number of pages3
ISBN (Electronic)9781467373562
DOIs
Publication statusPublished - 2015 Nov 10
EventIEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 - Grenoble, France
Duration: 2015 May 182015 May 21

Other

OtherIEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015
CountryFrance
CityGrenoble
Period15/5/1815/5/21

    Fingerprint

Keywords

  • Adhesives
  • Copper
  • Correlation
  • Decision support systems
  • Integrated circuits
  • Periodic structures
  • Silicon compounds

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kamiya, S., Chen, C., Shishido, N., Omiya, M., Koiwa, K., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T., & Suzuki, T. (2015). Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures. In 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 (pp. 151-153). [7325649] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC-MAM.2015.7325649