Abstract
Local apparent strength of interface between copper and cap layer on top was diverse depending on the crystal orientation underneath. For a comprehension of this diversity, physical adhesion energy to separate the interface was evaluated. It essentially does not include mechanical energy dissipating in plastic deformation in the process of crack extension. Sub-micron scale torsion test for elastic-plastic deformation properties and fracture tests on a number of different crystal orientations revealed that difference in adhesion energy is much smaller than difference in plastic dissipation energy. It is highly likely that small difference in the former is intensified through the latter, leading to a huge scatter in strength of LSI interconnect structures.
Original language | English |
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Title of host publication | 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 151-153 |
Number of pages | 3 |
ISBN (Electronic) | 9781467373562 |
DOIs | |
Publication status | Published - 2015 Nov 10 |
Event | IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 - Grenoble, France Duration: 2015 May 18 → 2015 May 21 |
Other
Other | IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 |
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Country | France |
City | Grenoble |
Period | 15/5/18 → 15/5/21 |
Keywords
- Adhesives
- Copper
- Correlation
- Decision support systems
- Integrated circuits
- Periodic structures
- Silicon compounds
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials