Evaluation of electrical characteristics of the layer-by-layer self-assembled films after the various annealing temperatures

Yoshinori Yamagata; Seimei Shiratori

doi:10.1016/S0040-6090(03)00786-7

Evaluation of electrical characteristics of the layer-by-layer self-assembled films after the various annealing temperatures

Yoshinori Yamagata, Seimei Shiratori

Department of Applied Physics and Physico-Informatics

Research output: Contribution to journal › Conference article › peer-review

12 Citations (Scopus)

Abstract

Layer-by-layer self-assembled multilayer films were prepared by the alternate deposition of poly(allylamine hydrochloride)(PAH) and poly(acrylic acid)(PAA). DC current-voltage characteristics of Au/(PAH/PAA)₁₅₀/Au (MIM) sandwich structure devices after the annealing treatment of several temperatures were measured. It was found that the resistivity of the MIM devices drastically increased by annealing at the temperature which is higher than the glass transition temperature (T_g) from the self-assembled multilayer films. We consider that it is very important to remove the moisture from the inside of the self-assembled multilayer films to obtain the higher resistivity. And it was ascertained by Fourier transform infrared radiation spectroscopy measurement that the structural change in the self-assembled multilayer films, which was induced by micro-Brownian motion in the vicinity of the T_g, also affected the higher resistivity.

Original language	English
Pages (from-to)	238-242
Number of pages	5
Journal	Thin Solid Films
Volume	438-439
DOIs	https://doi.org/10.1016/S0040-6090(03)00786-7
Publication status	Published - 2003 Aug 22
Event	The 5th International Conference on Nano-Molecular Electronics - Kobe, Japan Duration: 2002 Dec 10 → 2002 Dec 12

Keywords

Annealing treatment
Layer-by-layer self-assembled multilayer films
Resistivity
Structural change

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Metals and Alloys
Materials Chemistry

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title = "Evaluation of electrical characteristics of the layer-by-layer self-assembled films after the various annealing temperatures",

abstract = "Layer-by-layer self-assembled multilayer films were prepared by the alternate deposition of poly(allylamine hydrochloride)(PAH) and poly(acrylic acid)(PAA). DC current-voltage characteristics of Au/(PAH/PAA)150/Au (MIM) sandwich structure devices after the annealing treatment of several temperatures were measured. It was found that the resistivity of the MIM devices drastically increased by annealing at the temperature which is higher than the glass transition temperature (Tg) from the self-assembled multilayer films. We consider that it is very important to remove the moisture from the inside of the self-assembled multilayer films to obtain the higher resistivity. And it was ascertained by Fourier transform infrared radiation spectroscopy measurement that the structural change in the self-assembled multilayer films, which was induced by micro-Brownian motion in the vicinity of the Tg, also affected the higher resistivity.",

keywords = "Annealing treatment, Layer-by-layer self-assembled multilayer films, Resistivity, Structural change",

author = "Yoshinori Yamagata and Seimei Shiratori",

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doi = "10.1016/S0040-6090(03)00786-7",

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note = "The 5th International Conference on Nano-Molecular Electronics ; Conference date: 10-12-2002 Through 12-12-2002",

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T1 - Evaluation of electrical characteristics of the layer-by-layer self-assembled films after the various annealing temperatures

AU - Yamagata, Yoshinori

AU - Shiratori, Seimei

PY - 2003/8/22

Y1 - 2003/8/22

N2 - Layer-by-layer self-assembled multilayer films were prepared by the alternate deposition of poly(allylamine hydrochloride)(PAH) and poly(acrylic acid)(PAA). DC current-voltage characteristics of Au/(PAH/PAA)150/Au (MIM) sandwich structure devices after the annealing treatment of several temperatures were measured. It was found that the resistivity of the MIM devices drastically increased by annealing at the temperature which is higher than the glass transition temperature (Tg) from the self-assembled multilayer films. We consider that it is very important to remove the moisture from the inside of the self-assembled multilayer films to obtain the higher resistivity. And it was ascertained by Fourier transform infrared radiation spectroscopy measurement that the structural change in the self-assembled multilayer films, which was induced by micro-Brownian motion in the vicinity of the Tg, also affected the higher resistivity.

AB - Layer-by-layer self-assembled multilayer films were prepared by the alternate deposition of poly(allylamine hydrochloride)(PAH) and poly(acrylic acid)(PAA). DC current-voltage characteristics of Au/(PAH/PAA)150/Au (MIM) sandwich structure devices after the annealing treatment of several temperatures were measured. It was found that the resistivity of the MIM devices drastically increased by annealing at the temperature which is higher than the glass transition temperature (Tg) from the self-assembled multilayer films. We consider that it is very important to remove the moisture from the inside of the self-assembled multilayer films to obtain the higher resistivity. And it was ascertained by Fourier transform infrared radiation spectroscopy measurement that the structural change in the self-assembled multilayer films, which was induced by micro-Brownian motion in the vicinity of the Tg, also affected the higher resistivity.

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KW - Layer-by-layer self-assembled multilayer films

KW - Resistivity

KW - Structural change

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JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

T2 - The 5th International Conference on Nano-Molecular Electronics

Y2 - 10 December 2002 through 12 December 2002

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