Evaluation of fatigue strength for solder joints after thermal aging

Takeshi Miyazaki; Masaki Oomiya; Hirotsugu Inoue; Kikuo Kishimoto; Masazumi Amagai

doi:10.1109/EMAP.2005.1598264

Evaluation of fatigue strength for solder joints after thermal aging

Takeshi Miyazaki, Masaki Oomiya, Hirotsugu Inoue, Kikuo Kishimoto, Masazumi Amagai

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Recently, preventing environmental pollutions, lead-free(Pb-free) solders are about to replace tin-lead(Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.

Original language	English
Title of host publication	Proceedings - EMAP 2005
Subtitle of host publication	2005 International Symposium on Electronics Materials and Packaging
Pages	215-219
Number of pages	5
DOIs	https://doi.org/10.1109/EMAP.2005.1598264
Publication status	Published - 2005 Dec 1
Externally published	Yes
Event	EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan Duration: 2005 Dec 11 → 2005 Dec 14

Publication series

Name	Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
Volume	2005

Other

Other	EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
Country/Territory	Japan
City	Tokyo
Period	05/12/11 → 05/12/14

ASJC Scopus subject areas

Engineering(all)

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10.1109/EMAP.2005.1598264

Cite this

Miyazaki, T., Oomiya, M., Inoue, H., Kishimoto, K., & Amagai, M. (2005). Evaluation of fatigue strength for solder joints after thermal aging. In Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging (pp. 215-219). [1598264] (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging; Vol. 2005). https://doi.org/10.1109/EMAP.2005.1598264

Evaluation of fatigue strength for solder joints after thermal aging. / Miyazaki, Takeshi; Oomiya, Masaki; Inoue, Hirotsugu et al.

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. 2005. p. 215-219 1598264 (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Miyazaki, T, Oomiya, M, Inoue, H, Kishimoto, K & Amagai, M 2005, Evaluation of fatigue strength for solder joints after thermal aging. in Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging., 1598264, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, vol. 2005, pp. 215-219, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, 05/12/11. https://doi.org/10.1109/EMAP.2005.1598264

Miyazaki T, Oomiya M, Inoue H, Kishimoto K, Amagai M. Evaluation of fatigue strength for solder joints after thermal aging. In Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. 2005. p. 215-219. 1598264. (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging). doi: 10.1109/EMAP.2005.1598264

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author = "Takeshi Miyazaki and Masaki Oomiya and Hirotsugu Inoue and Kikuo Kishimoto and Masazumi Amagai",

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AB - Recently, preventing environmental pollutions, lead-free(Pb-free) solders are about to replace tin-lead(Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.

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ER -

Evaluation of fatigue strength for solder joints after thermal aging

Abstract

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ASJC Scopus subject areas

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