Evaluation of fatigue strength for solder joints after thermal aging

Takeshi Miyazaki, Masaki Omiya, Hirotsugu Inoue, Kikuo Kishimoto, Masazumi Amagai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Recently, preventing environmental pollutions, lead-free(Pb-free) solders are about to replace tin-lead(Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.

Original languageEnglish
Title of host publicationProceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
Pages215-219
Number of pages5
Volume2005
DOIs
Publication statusPublished - 2005
Externally publishedYes
EventEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan
Duration: 2005 Dec 112005 Dec 14

Other

OtherEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
CountryJapan
CityTokyo
Period05/12/1105/12/14

Fingerprint

Thermal aging
Soldering alloys
Fatigue of materials
Eutectics
Tin
Pollution
Lead
Fatigue strength
Lead-free solders
Metals

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Miyazaki, T., Omiya, M., Inoue, H., Kishimoto, K., & Amagai, M. (2005). Evaluation of fatigue strength for solder joints after thermal aging. In Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging (Vol. 2005, pp. 215-219). [1598264] https://doi.org/10.1109/EMAP.2005.1598264

Evaluation of fatigue strength for solder joints after thermal aging. / Miyazaki, Takeshi; Omiya, Masaki; Inoue, Hirotsugu; Kishimoto, Kikuo; Amagai, Masazumi.

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005 2005. p. 215-219 1598264.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miyazaki, T, Omiya, M, Inoue, H, Kishimoto, K & Amagai, M 2005, Evaluation of fatigue strength for solder joints after thermal aging. in Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. vol. 2005, 1598264, pp. 215-219, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, 05/12/11. https://doi.org/10.1109/EMAP.2005.1598264
Miyazaki T, Omiya M, Inoue H, Kishimoto K, Amagai M. Evaluation of fatigue strength for solder joints after thermal aging. In Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005. 2005. p. 215-219. 1598264 https://doi.org/10.1109/EMAP.2005.1598264
Miyazaki, Takeshi ; Omiya, Masaki ; Inoue, Hirotsugu ; Kishimoto, Kikuo ; Amagai, Masazumi. / Evaluation of fatigue strength for solder joints after thermal aging. Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005 2005. pp. 215-219
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