Evaluation of fatigue strength for solder joints after thermal aging

Takeshi Miyazaki, Masaki Oomiya, Hirotsugu Inoue, Kikuo Kishimoto, Masazumi Amagai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Recently, preventing environmental pollutions, lead-free(Pb-free) solders are about to replace tin-lead(Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.

Original languageEnglish
Title of host publicationProceedings - EMAP 2005
Subtitle of host publication2005 International Symposium on Electronics Materials and Packaging
Pages215-219
Number of pages5
DOIs
Publication statusPublished - 2005 Dec 1
Externally publishedYes
EventEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan
Duration: 2005 Dec 112005 Dec 14

Publication series

NameProceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
Volume2005

Other

OtherEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
CountryJapan
CityTokyo
Period05/12/1105/12/14

ASJC Scopus subject areas

  • Engineering(all)

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