Evaluation of ground slippery condition during walk of bipedal robot using MEMS slip sensor

Taiyu Okatani, Hidetoshi Takahashi, Tomoyuki Takahata, Isao Shimoyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper reports on a method to evaluate ground slippery condition using a MEMS slip sensor. The sensor discriminates between ground slippery and non-slippery conditions during walking motions of a bipedal robot, which enables the robot to prevent a slip. First, we evaluated the responses of the sensor pressed against an oiled or non-oiled surface. Then, we proposed a discriminating method between the oiled and non-oiled surfaces using the sensor. Finally, we demonstrated that a bipedal robot was able to evaluate the slippery condition of the ground where the foot of the robot landed during walk.

Original languageEnglish
Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1033-1035
Number of pages3
ISBN (Electronic)9781509050789
DOIs
Publication statusPublished - 2017 Feb 23
Externally publishedYes
Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
Duration: 2017 Jan 222017 Jan 26

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
CountryUnited States
CityLas Vegas
Period17/1/2217/1/26

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Okatani, T., Takahashi, H., Takahata, T., & Shimoyama, I. (2017). Evaluation of ground slippery condition during walk of bipedal robot using MEMS slip sensor. In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 1033-1035). [7863588] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863588