Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures

Masaki Omiya, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Chuantong Chen, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

The local interfacial strength is a key factor in designing and fabricating advanced three-dimensional large-scale integration interconnect structures. In this paper, both local fracture tests and three-dimensional elastic-plastic crack propagation analysis for a 10 μm × 10 μm specimen were performed, and the local interfacial adhesion between a Cu interconnect and a SiN cap layer were evaluated. The three-dimensional elastic-plastic crack propagation simulation was developed to evaluate the interfacial adhesion that eliminated the effect of progressive plastic dissipation energy during crack propagation. The results show that the average interfacial adhesion for Cu/SiN is 4.46 ± 0.17 J/m2. The crack propagation behavior and fracture pattern depend on the interfacial adhesion, and these differences are due to the plastic yielding of the side edge of the specimen. The critical interfacial adhesion for the onset of shear fracture is 4.92 J/m2, which is the upper bound of the interfacial adhesion evaluation for the 10 μm × 10 μm specimen.

Original languageEnglish
Pages (from-to)612-621
Number of pages10
JournalMicroelectronics Reliability
Volume53
Issue number4
DOIs
Publication statusPublished - 2013 Apr

Fingerprint

large scale integration
adhesion
Adhesion
crack propagation
evaluation
Crack propagation
Plastics
plastics
LSI circuits
caps
plastic deformation
Energy dissipation
energy dissipation
shear
simulation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality

Cite this

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. / Omiya, Masaki; Koiwa, Kozo; Shishido, Nobuyuki; Kamiya, Shoji; Chen, Chuantong; Sato, Hisashi; Nishida, Masahiro; Suzuki, Takashi; Nakamura, Tomoji; Suzuki, Toshiaki; Nokuo, Takeshi.

In: Microelectronics Reliability, Vol. 53, No. 4, 04.2013, p. 612-621.

Research output: Contribution to journalArticle

Omiya, M, Koiwa, K, Shishido, N, Kamiya, S, Chen, C, Sato, H, Nishida, M, Suzuki, T, Nakamura, T, Suzuki, T & Nokuo, T 2013, 'Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures', Microelectronics Reliability, vol. 53, no. 4, pp. 612-621. https://doi.org/10.1016/j.microrel.2012.12.009
Omiya, Masaki ; Koiwa, Kozo ; Shishido, Nobuyuki ; Kamiya, Shoji ; Chen, Chuantong ; Sato, Hisashi ; Nishida, Masahiro ; Suzuki, Takashi ; Nakamura, Tomoji ; Suzuki, Toshiaki ; Nokuo, Takeshi. / Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. In: Microelectronics Reliability. 2013 ; Vol. 53, No. 4. pp. 612-621.
@article{8458d1a514be4184bc680b59736dd77f,
title = "Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures",
abstract = "The local interfacial strength is a key factor in designing and fabricating advanced three-dimensional large-scale integration interconnect structures. In this paper, both local fracture tests and three-dimensional elastic-plastic crack propagation analysis for a 10 μm × 10 μm specimen were performed, and the local interfacial adhesion between a Cu interconnect and a SiN cap layer were evaluated. The three-dimensional elastic-plastic crack propagation simulation was developed to evaluate the interfacial adhesion that eliminated the effect of progressive plastic dissipation energy during crack propagation. The results show that the average interfacial adhesion for Cu/SiN is 4.46 ± 0.17 J/m2. The crack propagation behavior and fracture pattern depend on the interfacial adhesion, and these differences are due to the plastic yielding of the side edge of the specimen. The critical interfacial adhesion for the onset of shear fracture is 4.92 J/m2, which is the upper bound of the interfacial adhesion evaluation for the 10 μm × 10 μm specimen.",
author = "Masaki Omiya and Kozo Koiwa and Nobuyuki Shishido and Shoji Kamiya and Chuantong Chen and Hisashi Sato and Masahiro Nishida and Takashi Suzuki and Tomoji Nakamura and Toshiaki Suzuki and Takeshi Nokuo",
year = "2013",
month = "4",
doi = "10.1016/j.microrel.2012.12.009",
language = "English",
volume = "53",
pages = "612--621",
journal = "Microelectronics and Reliability",
issn = "0026-2714",
publisher = "Elsevier Limited",
number = "4",

}

TY - JOUR

T1 - Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures

AU - Omiya, Masaki

AU - Koiwa, Kozo

AU - Shishido, Nobuyuki

AU - Kamiya, Shoji

AU - Chen, Chuantong

AU - Sato, Hisashi

AU - Nishida, Masahiro

AU - Suzuki, Takashi

AU - Nakamura, Tomoji

AU - Suzuki, Toshiaki

AU - Nokuo, Takeshi

PY - 2013/4

Y1 - 2013/4

N2 - The local interfacial strength is a key factor in designing and fabricating advanced three-dimensional large-scale integration interconnect structures. In this paper, both local fracture tests and three-dimensional elastic-plastic crack propagation analysis for a 10 μm × 10 μm specimen were performed, and the local interfacial adhesion between a Cu interconnect and a SiN cap layer were evaluated. The three-dimensional elastic-plastic crack propagation simulation was developed to evaluate the interfacial adhesion that eliminated the effect of progressive plastic dissipation energy during crack propagation. The results show that the average interfacial adhesion for Cu/SiN is 4.46 ± 0.17 J/m2. The crack propagation behavior and fracture pattern depend on the interfacial adhesion, and these differences are due to the plastic yielding of the side edge of the specimen. The critical interfacial adhesion for the onset of shear fracture is 4.92 J/m2, which is the upper bound of the interfacial adhesion evaluation for the 10 μm × 10 μm specimen.

AB - The local interfacial strength is a key factor in designing and fabricating advanced three-dimensional large-scale integration interconnect structures. In this paper, both local fracture tests and three-dimensional elastic-plastic crack propagation analysis for a 10 μm × 10 μm specimen were performed, and the local interfacial adhesion between a Cu interconnect and a SiN cap layer were evaluated. The three-dimensional elastic-plastic crack propagation simulation was developed to evaluate the interfacial adhesion that eliminated the effect of progressive plastic dissipation energy during crack propagation. The results show that the average interfacial adhesion for Cu/SiN is 4.46 ± 0.17 J/m2. The crack propagation behavior and fracture pattern depend on the interfacial adhesion, and these differences are due to the plastic yielding of the side edge of the specimen. The critical interfacial adhesion for the onset of shear fracture is 4.92 J/m2, which is the upper bound of the interfacial adhesion evaluation for the 10 μm × 10 μm specimen.

UR - http://www.scopus.com/inward/record.url?scp=84875525761&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84875525761&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2012.12.009

DO - 10.1016/j.microrel.2012.12.009

M3 - Article

AN - SCOPUS:84875525761

VL - 53

SP - 612

EP - 621

JO - Microelectronics and Reliability

JF - Microelectronics and Reliability

SN - 0026-2714

IS - 4

ER -