Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead

Roshan Lalintha Peiris, Wei Peng, Zikun Chen, Kouta Minamizawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Haptic feedback systems for spatial awareness are widely used in navigational and obstacle detection tasks and mostly used in combination with vibrotactile modules. As such, this work explores using thermal haptic feedback on the forehead for spatial awareness. As an initial step in this direction, our goal is to investigate the performance of different cueing methods for a minimal number of thermal elements. As such, the system uses three equally distributed peltier modules on the forehead to provide the thermal feedback. We investigated three different cuing methods with 30, 150 and 450 effective haptic feedback ranges. The results indicate that the 30 method to be the most precise (lowest error) while the 450 method to be the fastest for detecting the target.

Original languageEnglish
Title of host publication2017 IEEE World Haptics Conference, WHC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages400-405
Number of pages6
ISBN (Electronic)9781509014255
DOIs
Publication statusPublished - 2017 Jul 21
Event7th IEEE World Haptics Conference, WHC 2017 - Munich, Germany
Duration: 2017 Jun 62017 Jun 9

Other

Other7th IEEE World Haptics Conference, WHC 2017
CountryGermany
CityMunich
Period17/6/617/6/9

Fingerprint

forehead
Forehead
cues
Cues
Hot Temperature
Feedback
modules
performance

ASJC Scopus subject areas

  • Instrumentation
  • Cognitive Neuroscience
  • Sensory Systems
  • Human Factors and Ergonomics
  • Human-Computer Interaction

Cite this

Peiris, R. L., Peng, W., Chen, Z., & Minamizawa, K. (2017). Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead. In 2017 IEEE World Haptics Conference, WHC 2017 (pp. 400-405). [7989935] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/WHC.2017.7989935

Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead. / Peiris, Roshan Lalintha; Peng, Wei; Chen, Zikun; Minamizawa, Kouta.

2017 IEEE World Haptics Conference, WHC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 400-405 7989935.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Peiris, RL, Peng, W, Chen, Z & Minamizawa, K 2017, Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead. in 2017 IEEE World Haptics Conference, WHC 2017., 7989935, Institute of Electrical and Electronics Engineers Inc., pp. 400-405, 7th IEEE World Haptics Conference, WHC 2017, Munich, Germany, 17/6/6. https://doi.org/10.1109/WHC.2017.7989935
Peiris RL, Peng W, Chen Z, Minamizawa K. Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead. In 2017 IEEE World Haptics Conference, WHC 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 400-405. 7989935 https://doi.org/10.1109/WHC.2017.7989935
Peiris, Roshan Lalintha ; Peng, Wei ; Chen, Zikun ; Minamizawa, Kouta. / Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead. 2017 IEEE World Haptics Conference, WHC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 400-405
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