Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead

Roshan Lalintha Peiris; Wei Peng; Zikun Chen; Kouta Minamizawa

doi:10.1109/WHC.2017.7989935

Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead

Roshan Lalintha Peiris, Wei Peng, Zikun Chen, Kouta Minamizawa

Graduate School of Media Design

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

Haptic feedback systems for spatial awareness are widely used in navigational and obstacle detection tasks and mostly used in combination with vibrotactile modules. As such, this work explores using thermal haptic feedback on the forehead for spatial awareness. As an initial step in this direction, our goal is to investigate the performance of different cueing methods for a minimal number of thermal elements. As such, the system uses three equally distributed peltier modules on the forehead to provide the thermal feedback. We investigated three different cuing methods with 3⁰, 15⁰ and 45⁰ effective haptic feedback ranges. The results indicate that the 3⁰ method to be the most precise (lowest error) while the 45⁰ method to be the fastest for detecting the target.

Original language	English
Title of host publication	2017 IEEE World Haptics Conference, WHC 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	400-405
Number of pages	6
ISBN (Electronic)	9781509014255
DOIs	https://doi.org/10.1109/WHC.2017.7989935
Publication status	Published - 2017 Jul 21
Event	7th IEEE World Haptics Conference, WHC 2017 - Munich, Germany Duration: 2017 Jun 6 → 2017 Jun 9

Other

Other	7th IEEE World Haptics Conference, WHC 2017
Country	Germany
City	Munich
Period	17/6/6 → 17/6/9

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ASJC Scopus subject areas

Instrumentation
Cognitive Neuroscience
Sensory Systems
Human Factors and Ergonomics
Human-Computer Interaction

Cite this

Peiris, R. L., Peng, W., Chen, Z., & Minamizawa, K. (2017). Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead. In 2017 IEEE World Haptics Conference, WHC 2017 (pp. 400-405). [7989935] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/WHC.2017.7989935

Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead. / Peiris, Roshan Lalintha; Peng, Wei; Chen, Zikun; Minamizawa, Kouta.

2017 IEEE World Haptics Conference, WHC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 400-405 7989935.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Peiris, RL, Peng, W, Chen, Z & Minamizawa, K 2017, Exploration of cuing methods for localization of spatial cues using thermal haptic feedback on the forehead. in 2017 IEEE World Haptics Conference, WHC 2017., 7989935, Institute of Electrical and Electronics Engineers Inc., pp. 400-405, 7th IEEE World Haptics Conference, WHC 2017, Munich, Germany, 17/6/6. https://doi.org/10.1109/WHC.2017.7989935

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Access to Document

10.1109/WHC.2017.7989935