Fabrication and evaluation for polymer waveguide coupler devices using the imprint method

Fukino Nakazaki, Takaaki Ishigure

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

For further increase of data rate in multimode fiber (MMF) links widely deployed in datacenters, wavelength division multiplexing (WDM) transmission technology is expected to be introduced. In this paper, we propose a Y-branched polymer waveguide with graded-index core for optical coupler in the MMF WDM links. The low loss structure of the Y-branched polymer waveguide is designed applying BPM simulation, and designed waveguide structures are actually fabricated using an imprint method to confirm their applicability to a low-loss optical coupler in MMF WDM links.

Original languageEnglish
Title of host publication2018 IEEE CPMT Symposium Japan, ICSJ 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages175-178
Number of pages4
ISBN (Electronic)9781538654422
DOIs
Publication statusPublished - 2019 Jan 4
Event2018 IEEE CPMT Symposium Japan, ICSJ 2018 - Kyoto, Japan
Duration: 2018 Nov 192018 Nov 21

Publication series

Name2018 IEEE CPMT Symposium Japan, ICSJ 2018

Conference

Conference2018 IEEE CPMT Symposium Japan, ICSJ 2018
CountryJapan
CityKyoto
Period18/11/1918/11/21

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Keywords

  • Beam propagation method
  • Imprint Method
  • multimode fiber link
  • optical coupler
  • Y branched polymer optical waveguide

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

Cite this

Nakazaki, F., & Ishigure, T. (2019). Fabrication and evaluation for polymer waveguide coupler devices using the imprint method. In 2018 IEEE CPMT Symposium Japan, ICSJ 2018 (pp. 175-178). [8602661] (2018 IEEE CPMT Symposium Japan, ICSJ 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2018.8602661