Abstract
The soft-lithography method is applied to an organic-inorganic hybrid resin for fabricating low-loss and thermally stable (solder-reflow capable) graded-index polymer optical waveguides. By adjusting the UV exposure condition, the insertion loss is successfully lowered, because a near parabolic index profile is formed in the core.
Original language | English |
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Title of host publication | 2016 IEEE Photonics Conference, IPC 2016 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 753-754 |
Number of pages | 2 |
ISBN (Electronic) | 9781509019069 |
DOIs | |
Publication status | Published - 2017 Jan 23 |
Event | 29th IEEE Photonics Conference, IPC 2016 - Waikoloa, United States Duration: 2016 Oct 2 → 2016 Oct 6 |
Other
Other | 29th IEEE Photonics Conference, IPC 2016 |
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Country/Territory | United States |
City | Waikoloa |
Period | 16/10/2 → 16/10/6 |
ASJC Scopus subject areas
- Computer Networks and Communications
- Electrical and Electronic Engineering
- Atomic and Molecular Physics, and Optics