Fabrication for low-loss polymer optical waveguides with 90° bending using the Mosquito method

Asami Takahashi, Takaaki Ishigure

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

We fabricate graded index (GI) circular core multimode polymer optical waveguides with 90° bending using the Mosquito method, and demonstrate low bending loss even if the bend radius is as small as 1 mm.

Original languageEnglish
Title of host publicationIEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium
Subtitle of host publication"Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages162-165
Number of pages4
ISBN (Electronic)9781479961955
DOIs
Publication statusPublished - 2014 Jan 13
Event2014 4th IEEE CPMT Symposium Japan, ICSJ 2014 - Kyoto, Japan
Duration: 2014 Nov 42014 Nov 6

Publication series

NameIEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014

Other

Other2014 4th IEEE CPMT Symposium Japan, ICSJ 2014
CountryJapan
CityKyoto
Period14/11/414/11/6

Keywords

  • boardlevel integration
  • optoelectronics packaging & subsystems
  • polymer optical waveguide

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Takahashi, A., & Ishigure, T. (2014). Fabrication for low-loss polymer optical waveguides with 90° bending using the Mosquito method. In IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014 (pp. 162-165). [7009635] (IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2014.7009635