Fabrication for organic-inorganic hybrid resin based single-mode polymer optical waveguides using the imprinting method for high density optical circuit

Yuto Fujihara, Takaaki Ishigure

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Single-mode polymer optical waveguides applicable to silicon photonics technologies are fabricated using the imprinting method. Organic-inorganic hybrid resins are applied to fabricate the waveguides with low propagation loss at longer wavelengths and with high thermal resistance. The obtained optical waveguides have a graded refractive index distribution, by which the single-mode condition could be satisfied with a larger core size.

Original languageEnglish
Title of host publication2018 IEEE CPMT Symposium Japan, ICSJ 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages125-126
Number of pages2
ISBN (Electronic)9781538654422
DOIs
Publication statusPublished - 2019 Jan 4
Event2018 IEEE CPMT Symposium Japan, ICSJ 2018 - Kyoto, Japan
Duration: 2018 Nov 192018 Nov 21

Publication series

Name2018 IEEE CPMT Symposium Japan, ICSJ 2018

Conference

Conference2018 IEEE CPMT Symposium Japan, ICSJ 2018
CountryJapan
CityKyoto
Period18/11/1918/11/21

Keywords

  • graded-index
  • imprinting method
  • optical interconnection
  • silicon photonics
  • single-mode polymer optical waveguide

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

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    Fujihara, Y., & Ishigure, T. (2019). Fabrication for organic-inorganic hybrid resin based single-mode polymer optical waveguides using the imprinting method for high density optical circuit. In 2018 IEEE CPMT Symposium Japan, ICSJ 2018 (pp. 125-126). [8602808] (2018 IEEE CPMT Symposium Japan, ICSJ 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2018.8602808