Fabrication method of sub-micrometer size planar gap for the micro fabry-perot interferometer

T. Dohi, H. Hayashi, H. Onoe, K. Matsumoto, I. Shimoyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper reports on a fabrication method of sub-micrometer size tunable planar gaps for micro Fabry-Perot interferometers. We made an upper unit with a movable sub-micrometer step and a lower unit, separately. The upper unit was picked up and transferred to the lower unit by the stamping apparatus, and bonded to the lower unit by fusion bonding. Since the force during fusion bonding acts within a few nanometers only, the sub-micrometer size planar gap can be built. By using this fabrication method, we fabricated the 850 nm gap with a movable planar mirror of 500 μm in diameter. The gap was changed from 825 nm to 1020 nm by applying the voltage of 24 V.

Original languageEnglish
Title of host publicationMEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
Pages335-338
Number of pages4
DOIs
Publication statusPublished - 2008 Aug 29
Externally publishedYes
Event21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson - Tucson, AZ, United States
Duration: 2008 Jan 132008 Jan 17

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
CountryUnited States
CityTucson, AZ
Period08/1/1308/1/17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Dohi, T., Hayashi, H., Onoe, H., Matsumoto, K., & Shimoyama, I. (2008). Fabrication method of sub-micrometer size planar gap for the micro fabry-perot interferometer. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems (pp. 335-338). [4443661] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2008.4443661