Fabrication of hemispherical liquid encapsulated structures based on droplet molding

Hiroki Ishizuka, Norihisa Miki

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

We have developed and demonstrated a method for forming spherical structures of a thin polydimethylsiloxane (PDMS) membrane encapsulating a liquid. Liquid encapsulation can enhance the performance of microelectromechanical systems (MEMS) devices by providing deformability and improved dielectric properties. Parylene deposition and wafer bonding are applied to encapsulate liquid into a MEMS device. In parylene deposition, a parylene membrane is directly formed onto a liquid droplet. However, since the parylene membrane is stiff, the membrane is fragile. Although wafer bonding can encapsulate liquid between two substrates, the surface of the fabricated structure is normally flat. We propose a new liquid encapsulation method by dispensing liquid droplets. At first, a 20 μl PDMS droplet is dispensed on ethylene glycol. A 70 μl glycerin droplet is dispensed into a PDMS casting solution layer. The droplet forms a layer on heated ethylene glycol. Glycerin and ethylene glycol are chosen for their high boiling points. Additionally, a glycerin droplet is dispensed on the layer and surrounded by a thin PDMS casting solution film. The film is baked for 1 h at 75 °C. As the result, a structure encapsulating a liquid in a flexible PDMS membrane is obtained. We investigate the effects of the volume, surface tension, and guide thickness on the shape of the formed structures. We also evaluated the effect of the structure diameter on miniaturization. The structure can be adapted for various functions by changing the encapsulated liquid. We fabricated a stiffness-tunable structure by dispensing a magnetorheoligical fluid droplet with a stiffness that can be changed by an external magnetic field. We also confirmed that the proposed structure can produce stiffness differences that are distinguishable by humans.

Original languageEnglish
Article number125010
JournalJournal of Micromechanics and Microengineering
Volume25
Issue number12
DOIs
Publication statusPublished - 2015 Oct 27

Fingerprint

Molding
Fabrication
Polydimethylsiloxane
Liquids
Ethylene Glycol
Membranes
Ethylene glycol
Glycerol
Wafer bonding
Stiffness
Encapsulation
MEMS
Casting
Boiling point
Formability
Dielectric properties
Surface tension
baysilon
Magnetic fields
Fluids

Keywords

  • liquid encapsulation
  • MEMS
  • smart fluid
  • tactile display

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

Cite this

Fabrication of hemispherical liquid encapsulated structures based on droplet molding. / Ishizuka, Hiroki; Miki, Norihisa.

In: Journal of Micromechanics and Microengineering, Vol. 25, No. 12, 125010, 27.10.2015.

Research output: Contribution to journalArticle

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