Fatigue crack growth in lead-free solder joints

Masaki Omiya, Kikuo Kishimoto, Masazumi Amagai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper investigates the fatigue crack growth behaviors of lead-free solder joints. Metallurgical interactions occur between solders and electrical pad metals in fabrication process and these intermetallic compounds continue to grow during service periods. Due to its brittle nature and lattice mismatch, the solder cracks tend to be generated near the compounds and these cracks affects the mechanical integrity of solder joints. Therefore, it is important to study the effect of intermetallic compounds development on the mechanical properties of the solder joints. In this paper, we focused on the low cycle fatigue of solder joints and investigate the effects of intermetallic compounds development on the fatigue life and the fatigue crack growth behavior of the solder joints.

Original languageEnglish
Title of host publicationProceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
Pages232-237
Number of pages6
Volume2005
DOIs
Publication statusPublished - 2005
Externally publishedYes
EventEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan
Duration: 2005 Dec 112005 Dec 14

Other

OtherEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
CountryJapan
CityTokyo
Period05/12/1105/12/14

Fingerprint

Fatigue crack propagation
Soldering alloys
Intermetallics
Fatigue of materials
Cracks
Lattice mismatch
Lead-free solders
Fabrication
Mechanical properties
Metals

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Omiya, M., Kishimoto, K., & Amagai, M. (2005). Fatigue crack growth in lead-free solder joints. In Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging (Vol. 2005, pp. 232-237). [1598267] https://doi.org/10.1109/EMAP.2005.1598267

Fatigue crack growth in lead-free solder joints. / Omiya, Masaki; Kishimoto, Kikuo; Amagai, Masazumi.

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005 2005. p. 232-237 1598267.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Omiya, M, Kishimoto, K & Amagai, M 2005, Fatigue crack growth in lead-free solder joints. in Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. vol. 2005, 1598267, pp. 232-237, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, 05/12/11. https://doi.org/10.1109/EMAP.2005.1598267
Omiya M, Kishimoto K, Amagai M. Fatigue crack growth in lead-free solder joints. In Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005. 2005. p. 232-237. 1598267 https://doi.org/10.1109/EMAP.2005.1598267
Omiya, Masaki ; Kishimoto, Kikuo ; Amagai, Masazumi. / Fatigue crack growth in lead-free solder joints. Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005 2005. pp. 232-237
@inproceedings{d7e1459091994846a4b2b8d04ca82252,
title = "Fatigue crack growth in lead-free solder joints",
abstract = "This paper investigates the fatigue crack growth behaviors of lead-free solder joints. Metallurgical interactions occur between solders and electrical pad metals in fabrication process and these intermetallic compounds continue to grow during service periods. Due to its brittle nature and lattice mismatch, the solder cracks tend to be generated near the compounds and these cracks affects the mechanical integrity of solder joints. Therefore, it is important to study the effect of intermetallic compounds development on the mechanical properties of the solder joints. In this paper, we focused on the low cycle fatigue of solder joints and investigate the effects of intermetallic compounds development on the fatigue life and the fatigue crack growth behavior of the solder joints.",
author = "Masaki Omiya and Kikuo Kishimoto and Masazumi Amagai",
year = "2005",
doi = "10.1109/EMAP.2005.1598267",
language = "English",
isbn = "1424401070",
volume = "2005",
pages = "232--237",
booktitle = "Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging",

}

TY - GEN

T1 - Fatigue crack growth in lead-free solder joints

AU - Omiya, Masaki

AU - Kishimoto, Kikuo

AU - Amagai, Masazumi

PY - 2005

Y1 - 2005

N2 - This paper investigates the fatigue crack growth behaviors of lead-free solder joints. Metallurgical interactions occur between solders and electrical pad metals in fabrication process and these intermetallic compounds continue to grow during service periods. Due to its brittle nature and lattice mismatch, the solder cracks tend to be generated near the compounds and these cracks affects the mechanical integrity of solder joints. Therefore, it is important to study the effect of intermetallic compounds development on the mechanical properties of the solder joints. In this paper, we focused on the low cycle fatigue of solder joints and investigate the effects of intermetallic compounds development on the fatigue life and the fatigue crack growth behavior of the solder joints.

AB - This paper investigates the fatigue crack growth behaviors of lead-free solder joints. Metallurgical interactions occur between solders and electrical pad metals in fabrication process and these intermetallic compounds continue to grow during service periods. Due to its brittle nature and lattice mismatch, the solder cracks tend to be generated near the compounds and these cracks affects the mechanical integrity of solder joints. Therefore, it is important to study the effect of intermetallic compounds development on the mechanical properties of the solder joints. In this paper, we focused on the low cycle fatigue of solder joints and investigate the effects of intermetallic compounds development on the fatigue life and the fatigue crack growth behavior of the solder joints.

UR - http://www.scopus.com/inward/record.url?scp=33847254284&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33847254284&partnerID=8YFLogxK

U2 - 10.1109/EMAP.2005.1598267

DO - 10.1109/EMAP.2005.1598267

M3 - Conference contribution

SN - 1424401070

SN - 9781424401079

VL - 2005

SP - 232

EP - 237

BT - Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging

ER -