FBG strain sensor with simple temperature compensation mechanism

Hiroshi Hayano, Akira Mita

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

A FBG-based strain sensor equipped with a mechanical temperature compensation system is proposed. Direct bonding of a FBG element may cause broadening of the reflected optical spectrum due to fluctuation of strain distribution of the material under the FBG element. The proposed sensor avoids this difficulty by introducing a mechanism to induce uniform strain distribution to the FBG element. In addition, a simple mechanical system that can cancel the effect of temperature on the strain measurement eliminate the need for another FBG sensor for temperature compensation. Extensive tests have been conducted using prototype sensors. The results showed their excellent performance.

Original languageEnglish
Pages (from-to)167s-173
JournalStructural Engineering/Earthquake Engineering
Volume22
Issue number2
DOIs
Publication statusPublished - 2005 Dec 1

Keywords

  • FBG sensor
  • Strain measurement
  • Temperature compensation

ASJC Scopus subject areas

  • Civil and Structural Engineering
  • Building and Construction
  • Arts and Humanities (miscellaneous)
  • Geotechnical Engineering and Engineering Geology

Fingerprint Dive into the research topics of 'FBG strain sensor with simple temperature compensation mechanism'. Together they form a unique fingerprint.

  • Cite this