FBG strain sensor with temperature compensation mechanism

H. Hayano, A. Mita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

An FBG-based strain sensor equipped with a mechanical te mperature compensation system is proposed. Direct bonding of an FBG element, that is the simplest method to measure strains, may cause broadening of the reflected optical spectrum due to fluctuation of strain distribution of the material under the FBG element. The proposed sensor avoids this difficulty by introducing a mechanism to induce uniform strain distribution to the FBG element. In addition, a simple mechanical system that can cancel the effect of temperature on the strain measurement does eliminate the addition of another FBG sensor for temperature compensation. Extensive tests have been conducted using prototype sensors. The results showed their excellent performance.

Original languageEnglish
Title of host publicationStructural Health Monitoring and Intelligent Infrastructure - Proceedings of the 1st International Conference on Structural Health Monitoring and Intelligent Infrastructure
Pages1259-1266
Number of pages8
Publication statusPublished - 2003 Dec 1
Event1st International Conference on Structural Health Monitoring and Intelligent Infrastructure, SHMII-1'2003 - Tokyo, Japan
Duration: 2003 Nov 132003 Nov 15

Publication series

NameStructural Health Monitoring and Intelligent Infrastructure - Proceedings of the 1st International Conference on Structural Health Monitoring and Intelligent Infrastructure
Volume2

Other

Other1st International Conference on Structural Health Monitoring and Intelligent Infrastructure, SHMII-1'2003
CountryJapan
CityTokyo
Period03/11/1303/11/15

ASJC Scopus subject areas

  • Building and Construction
  • Architecture

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