Fined-grained body biasing for frequency scaling in advanced SOI processes

Johannes Maximilian Kuhn, Hideharu Amano, Oliver Bringmann, Wolfgang Rosenstiel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

New SOI processes offer unprecedented flexibility in regard to low-power and performance. The use of fine-grained body biasing in STMicro's 28nm UTBB-FDSOI is evaluated for a Dynamically Reconfigurable Processor design in a frequency scaling scenario. Three different strategies are evaluated for Processing Elements: Static, programmable and dynamic body biasing. Fine-grained body biasing significantly mitigates increased leakage currents of forward body biasing between 42.85% to 64.5% on average. This makes static body biasing a viable low-cost option and makes dynamic body biasing worthwhile even at short time periods.

Original languageEnglish
Title of host publicationIEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781467373258
DOIs
Publication statusPublished - 2015 Jul 14
Event18th IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips 2015 - Yokohama, Japan
Duration: 2015 Apr 132015 Apr 15

Other

Other18th IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips 2015
CountryJapan
CityYokohama
Period15/4/1315/4/15

Fingerprint

Leakage currents
Processing
Costs

Keywords

  • Body Biasing
  • Fine-Grained Power Management
  • Reconfigurable Architectures
  • SOI

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Kuhn, J. M., Amano, H., Bringmann, O., & Rosenstiel, W. (2015). Fined-grained body biasing for frequency scaling in advanced SOI processes. In IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings [7158655] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CoolChips.2015.7158655

Fined-grained body biasing for frequency scaling in advanced SOI processes. / Kuhn, Johannes Maximilian; Amano, Hideharu; Bringmann, Oliver; Rosenstiel, Wolfgang.

IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. 7158655.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuhn, JM, Amano, H, Bringmann, O & Rosenstiel, W 2015, Fined-grained body biasing for frequency scaling in advanced SOI processes. in IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings., 7158655, Institute of Electrical and Electronics Engineers Inc., 18th IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips 2015, Yokohama, Japan, 15/4/13. https://doi.org/10.1109/CoolChips.2015.7158655
Kuhn JM, Amano H, Bringmann O, Rosenstiel W. Fined-grained body biasing for frequency scaling in advanced SOI processes. In IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2015. 7158655 https://doi.org/10.1109/CoolChips.2015.7158655
Kuhn, Johannes Maximilian ; Amano, Hideharu ; Bringmann, Oliver ; Rosenstiel, Wolfgang. / Fined-grained body biasing for frequency scaling in advanced SOI processes. IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015.
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