Flexible distributed capacitive sensor with encapsulated ferroelectric liquid

Y. Hotta, Y. Zhang, N. Miki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

We demonstrate flexible and highly sensitive capacitive sensor arrays that encapsulate DI water as dielectric. DI water, which is a ferroelectric liquid and has a relative dielectric constant of approximately 80, could increase the capacitance of the sensor and enhance the sensitivity while maintaining flexibility of the sensor with electrodes patterned on flexible PDMS substrates. The proposed sensor was microfabricated and demonstrated successfully 40 times greater sensitivity than sensors without DI water. Since DI water is incompressible fluid, it restricted the displacements of the electrodes. We designed a reservoir of DI water where the DI water between the electrodes could escape, which allowed more deformation of the PDMS substrates and successfully augmented the sensitivity of the proposed sensor.

Original languageEnglish
Title of host publication2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages573-576
Number of pages4
DOIs
Publication statusPublished - 2011 Apr 13
Event24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
Duration: 2011 Jan 232011 Jan 27

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
CountryMexico
CityCancun
Period11/1/2311/1/27

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Hotta, Y., Zhang, Y., & Miki, N. (2011). Flexible distributed capacitive sensor with encapsulated ferroelectric liquid. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011 (pp. 573-576). [5734489] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2011.5734489