FolDTronics Demo: Creating 3D objects with integrated electronics using foldable honeycomb structures

Junichi Yamaoka, Yoshihiro Kawahara, Mustafa Doga Dogan, Yasuaki Kakehi, Katarina Bulovic, Stefanie Mueller, Kazuya Saito

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present FoldTronics, a 2D-cutting based fabrication technique to integrate electronics into 3D folded objects. The key idea is to cut and perforate a 2D sheet using a cutting plotter to make it foldable into a 3D honeycomb structure; before folding, users place the electronic components and circuitry onto the sheet. The fabrication process only takes a few minutes allowing to rapidly prototype functional interactive devices. The resulting objects are lightweight and rigid, thus allowing for weight-sensitive and force-sensitive applications. Due to the nature of honeycombs, the created objects can be folded flat along one axis and thus can be efficiently transported in this compact form factor.

Original languageEnglish
Title of host publicationCHI EA 2019 - Extended Abstracts of the 2019 CHI Conference on Human Factors in Computing Systems
PublisherAssociation for Computing Machinery
ISBN (Electronic)9781450359719
DOIs
Publication statusPublished - 2019 May 2
Externally publishedYes
Event2019 CHI Conference on Human Factors in Computing Systems, CHI EA 2019 - Glasgow, United Kingdom
Duration: 2019 May 42019 May 9

Publication series

NameConference on Human Factors in Computing Systems - Proceedings

Conference

Conference2019 CHI Conference on Human Factors in Computing Systems, CHI EA 2019
CountryUnited Kingdom
CityGlasgow
Period19/5/419/5/9

Keywords

  • 2D folding
  • Electronics
  • Personal fabrication

ASJC Scopus subject areas

  • Software
  • Human-Computer Interaction
  • Computer Graphics and Computer-Aided Design

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  • Cite this

    Yamaoka, J., Kawahara, Y., Dogan, M. D., Kakehi, Y., Bulovic, K., Mueller, S., & Saito, K. (2019). FolDTronics Demo: Creating 3D objects with integrated electronics using foldable honeycomb structures. In CHI EA 2019 - Extended Abstracts of the 2019 CHI Conference on Human Factors in Computing Systems [3313242] (Conference on Human Factors in Computing Systems - Proceedings). Association for Computing Machinery. https://doi.org/10.1145/3290607.3313242