Frequency model of haptic information in rubbing motion

Takami Miyagi, Seiichiro Katsura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper proposes the new frequency model of haptic information focused on the vibration component in friction force. Recently, haptic information is attracting attention from many areas as the tertiary media following the audio and visual information. However, due to the characters of the bidirectionality and self-reference, treatment is difficult as compared to the other sensory information. Unified representation method still not been established. Therefore, this paper focuses on the vibration components of friction force in rubbing motion against environmental surface in particular. The friction force in rubbing motion is measured for broadband by using the 2-DOF system constructed by two linear motors. For the quantitative evaluation of the frequency domain, cepstral analysis which is the method for voice-print analysis is applied. The effectiveness of the proposed model is shown by performing experiments and analysis with three different environmental surfaces. Moreover, this paper presents the identification for each parameters of the model from the acquired data, and construct a accurate model of the friction force for each environment.

Original languageEnglish
Title of host publicationIECON Proceedings (Industrial Electronics Conference)
Pages4132-4137
Number of pages6
DOIs
Publication statusPublished - 2013
Event39th Annual Conference of the IEEE Industrial Electronics Society, IECON 2013 - Vienna, Austria
Duration: 2013 Nov 102013 Nov 14

Other

Other39th Annual Conference of the IEEE Industrial Electronics Society, IECON 2013
CountryAustria
CityVienna
Period13/11/1013/11/14

    Fingerprint

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Miyagi, T., & Katsura, S. (2013). Frequency model of haptic information in rubbing motion. In IECON Proceedings (Industrial Electronics Conference) (pp. 4132-4137). [6699798] https://doi.org/10.1109/IECON.2013.6699798