Grain boundary structure of c-BN thin film synthesized by PVD method

Wei Lie Zhou, Yuichi Ikuhara, Tetsuya Suzuki

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Microstructure of cubic boron nitride (c-BN) films deposited on a Si substrate was investigated by transmission electron microscopy. The presence of cubic phase was clearly confirmed by taking the microdiffraction pattern and lattice image. Hexagonal boron nitride (/i-BN) with thickness 1-2 nm was often observed at the boundaries of c-BN films. The /i-BN phase at the boundary of the c-BN may be the reason of the high intrinsic compressive stress. It was suggested that the c-BN phase nucleated on the prism plane of /i-BN keeping the parallelism between the (111) c-BN and (0001) A-BN, although the slight deviation (~4°) was observed in some cases. The nucleation mechanism of c-BN was discussed analogous to that of diamond on graphite.

Original languageEnglish
Pages (from-to)1122-1126
Number of pages5
Journalmaterials transactions, jim
Volume37
Issue number5
Publication statusPublished - 1996
Externally publishedYes

Fingerprint

Cubic boron nitride
Physical vapor deposition
boron nitrides
Grain boundaries
grain boundaries
Thin films
thin films
Diamond
Graphite
Boron nitride
Prisms
Compressive stress
Diamonds
Nucleation
prisms
Transmission electron microscopy
graphite
diamonds
nucleation
Microstructure

Keywords

  • Cubic boron nitride
  • Hexagonal boron nitride
  • High resolution electron microscopy
  • Ion plating method
  • Orientation relationship
  • Thin film

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Grain boundary structure of c-BN thin film synthesized by PVD method. / Zhou, Wei Lie; Ikuhara, Yuichi; Suzuki, Tetsuya.

In: materials transactions, jim, Vol. 37, No. 5, 1996, p. 1122-1126.

Research output: Contribution to journalArticle

Zhou, Wei Lie ; Ikuhara, Yuichi ; Suzuki, Tetsuya. / Grain boundary structure of c-BN thin film synthesized by PVD method. In: materials transactions, jim. 1996 ; Vol. 37, No. 5. pp. 1122-1126.
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