Abstract
The adhesion strength distribution at the interface between damascene copper lines and the cap layers covering the lines was explored. A novel system composed of a dual-beam SEM/FIB equipped with a nanoindenter and an EBSD camera enabled successful evaluation with a resolution of the order of 300. nm, which is the scale of crystal grains. The adhesion strength was found to scatter in a range spanning roughly half to double the average value. Although no clear correlation was observed with the geometry of the copper line, the impact of the copper grain structure beneath the specimens was rather distinct, where the adhesion strength of specimens with grain boundary junctions observed on their footprints was significantly lower than that of specimens without junctions. This result suggests that the microscopic structure of deposited materials may strongly influence the strength of adhesion to neighboring layers. Therefore, the evaluation of local adhesion is important from an engineering point of view as a means for avoiding unexpected fractures at possible weak points and assessing the mechanical reliability of the layered systems.
| Original language | English |
|---|---|
| Pages (from-to) | 280-284 |
| Number of pages | 5 |
| Journal | Surface and Coatings Technology |
| Volume | 215 |
| DOIs | |
| Publication status | Published - 2013 Jan 25 |
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Keywords
- Adhesion strength
- Copper
- Crack extension
- Crystal grain
- Interconnect structure
- Local evaluation
ASJC Scopus subject areas
- Chemistry(all)
- Condensed Matter Physics
- Materials Chemistry
- Surfaces, Coatings and Films
- Surfaces and Interfaces
Cite this
Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits. / Kamiya, Shoji; Shishido, Nobuyuki; Watanabe, Shinsuke; Sato, Hisashi; Koiwa, Kozo; Omiya, Masaki; Nishida, Masahiro; Suzuki, Takashi; Nakamura, Tomoji; Nokuo, Takeshi; Nagasawa, Tadahiro.
In: Surface and Coatings Technology, Vol. 215, 25.01.2013, p. 280-284.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits
AU - Kamiya, Shoji
AU - Shishido, Nobuyuki
AU - Watanabe, Shinsuke
AU - Sato, Hisashi
AU - Koiwa, Kozo
AU - Omiya, Masaki
AU - Nishida, Masahiro
AU - Suzuki, Takashi
AU - Nakamura, Tomoji
AU - Nokuo, Takeshi
AU - Nagasawa, Tadahiro
PY - 2013/1/25
Y1 - 2013/1/25
N2 - The adhesion strength distribution at the interface between damascene copper lines and the cap layers covering the lines was explored. A novel system composed of a dual-beam SEM/FIB equipped with a nanoindenter and an EBSD camera enabled successful evaluation with a resolution of the order of 300. nm, which is the scale of crystal grains. The adhesion strength was found to scatter in a range spanning roughly half to double the average value. Although no clear correlation was observed with the geometry of the copper line, the impact of the copper grain structure beneath the specimens was rather distinct, where the adhesion strength of specimens with grain boundary junctions observed on their footprints was significantly lower than that of specimens without junctions. This result suggests that the microscopic structure of deposited materials may strongly influence the strength of adhesion to neighboring layers. Therefore, the evaluation of local adhesion is important from an engineering point of view as a means for avoiding unexpected fractures at possible weak points and assessing the mechanical reliability of the layered systems.
AB - The adhesion strength distribution at the interface between damascene copper lines and the cap layers covering the lines was explored. A novel system composed of a dual-beam SEM/FIB equipped with a nanoindenter and an EBSD camera enabled successful evaluation with a resolution of the order of 300. nm, which is the scale of crystal grains. The adhesion strength was found to scatter in a range spanning roughly half to double the average value. Although no clear correlation was observed with the geometry of the copper line, the impact of the copper grain structure beneath the specimens was rather distinct, where the adhesion strength of specimens with grain boundary junctions observed on their footprints was significantly lower than that of specimens without junctions. This result suggests that the microscopic structure of deposited materials may strongly influence the strength of adhesion to neighboring layers. Therefore, the evaluation of local adhesion is important from an engineering point of view as a means for avoiding unexpected fractures at possible weak points and assessing the mechanical reliability of the layered systems.
KW - Adhesion strength
KW - Copper
KW - Crack extension
KW - Crystal grain
KW - Interconnect structure
KW - Local evaluation
UR - http://www.scopus.com/inward/record.url?scp=84872678056&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84872678056&partnerID=8YFLogxK
U2 - 10.1016/j.surfcoat.2012.07.100
DO - 10.1016/j.surfcoat.2012.07.100
M3 - Article
AN - SCOPUS:84872678056
VL - 215
SP - 280
EP - 284
JO - Surface and Coatings Technology
JF - Surface and Coatings Technology
SN - 0257-8972
ER -