HapticAid: Haptic experiences system using mobile platform

Tomosuke Maeda, Keitaro Tsuchiya, Roshan Peiris, Yoshihiro Tanaka, Kouta Minamizawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

We developed HapticAid, which is a wearable haptic augmentation system. This system enhances the skin vibrations that occur during touch and provide them as haptic feedback on the wrist. We revised HapticAid to be wearable and mobile by using a mobile platform and installed a digital signal processing to control haptic feedback for haptic experiences. This paper describes the implementation of our system, design of digital signal processing the method of wearing our system for haptic experiences.

Original languageEnglish
Title of host publicationTEI 2017 - Proceedings of the 11th International Conference on Tangible, Embedded, and Embodied Interaction
PublisherAssociation for Computing Machinery, Inc
Pages397-402
Number of pages6
ISBN (Electronic)9781450346764
DOIs
Publication statusPublished - 2017 Mar 20
Externally publishedYes
Event11th ACM International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2017 - Yokohama, Japan
Duration: 2017 Mar 202017 Mar 23

Other

Other11th ACM International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2017
CountryJapan
CityYokohama
Period17/3/2017/3/23

Fingerprint

Digital signal processing
Feedback
Skin
Systems analysis

Keywords

  • Embodied Media
  • Haptic Augmentation
  • Haptic Feedback
  • Wearable Device

ASJC Scopus subject areas

  • Human-Computer Interaction
  • Information Systems
  • Computer Graphics and Computer-Aided Design
  • Software

Cite this

Maeda, T., Tsuchiya, K., Peiris, R., Tanaka, Y., & Minamizawa, K. (2017). HapticAid: Haptic experiences system using mobile platform. In TEI 2017 - Proceedings of the 11th International Conference on Tangible, Embedded, and Embodied Interaction (pp. 397-402). Association for Computing Machinery, Inc. https://doi.org/10.1145/3024969.3025063

HapticAid : Haptic experiences system using mobile platform. / Maeda, Tomosuke; Tsuchiya, Keitaro; Peiris, Roshan; Tanaka, Yoshihiro; Minamizawa, Kouta.

TEI 2017 - Proceedings of the 11th International Conference on Tangible, Embedded, and Embodied Interaction. Association for Computing Machinery, Inc, 2017. p. 397-402.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Maeda, T, Tsuchiya, K, Peiris, R, Tanaka, Y & Minamizawa, K 2017, HapticAid: Haptic experiences system using mobile platform. in TEI 2017 - Proceedings of the 11th International Conference on Tangible, Embedded, and Embodied Interaction. Association for Computing Machinery, Inc, pp. 397-402, 11th ACM International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2017, Yokohama, Japan, 17/3/20. https://doi.org/10.1145/3024969.3025063
Maeda T, Tsuchiya K, Peiris R, Tanaka Y, Minamizawa K. HapticAid: Haptic experiences system using mobile platform. In TEI 2017 - Proceedings of the 11th International Conference on Tangible, Embedded, and Embodied Interaction. Association for Computing Machinery, Inc. 2017. p. 397-402 https://doi.org/10.1145/3024969.3025063
Maeda, Tomosuke ; Tsuchiya, Keitaro ; Peiris, Roshan ; Tanaka, Yoshihiro ; Minamizawa, Kouta. / HapticAid : Haptic experiences system using mobile platform. TEI 2017 - Proceedings of the 11th International Conference on Tangible, Embedded, and Embodied Interaction. Association for Computing Machinery, Inc, 2017. pp. 397-402
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