HeatSense - Thermal sensory supplementation for superhuman sports

Kirill Ragozin, George Chernyshov, Kai Kunze

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a sensory supplementation experience in virtual reality based on the thermal and vibrotactile feedback. We have implemented a physical system that provides hot and cold sensations around the hand and forearm of the person wearing it. After being equipped with the system the user is exposed to the virtual reality environment with the goal to deflect projectiles coming their way while relying on the thermal sensations to detect them. Presented experience makes a case for using thermal sensory supplementation as an interaction modality in virtual reality environments.

Original languageEnglish
Title of host publication26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1831-1833
Number of pages3
ISBN (Electronic)9781728113777
DOIs
Publication statusPublished - 2019 Mar
Event26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019 - Osaka, Japan
Duration: 2019 Mar 232019 Mar 27

Publication series

Name26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019 - Proceedings

Conference

Conference26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019
CountryJapan
CityOsaka
Period19/3/2319/3/27

Keywords

  • Haptic feedback
  • Sensory supplementation
  • Superhuman sports
  • Thermal feedback
  • Virtual reality

ASJC Scopus subject areas

  • Human-Computer Interaction
  • Media Technology

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  • Cite this

    Ragozin, K., Chernyshov, G., & Kunze, K. (2019). HeatSense - Thermal sensory supplementation for superhuman sports. In 26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019 - Proceedings (pp. 1831-1833). [8798125] (26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VR.2019.8798125