TY - GEN
T1 - High-density wiring of polymer optical waveguides fabricated using a microdispenser
AU - Suganuma, Daisuke
AU - Ishigure, Takaaki
PY - 2014/1/1
Y1 - 2014/1/1
N2 - Single-mode polymer optical waveguides with circular cores are successfully fabricated using the Mosquito method. Furthermore, fabrication conditions for densely aligned waveguides having graded-index circular cores with a 25-μm diameter are also investigated, in which the inter-channel pitch is reduced to 60 μm. By applying the three-dimensional (3-D) alignment conditions with the Mosquito method, fan-out waveguides are fabricated: three cores are obliquely aligned with a 40-μm pitch, while at the other end, the three cores are horizontally aligned in line with a 250-μm pitch. The insertion loss as low as 2.85 dB at 850-nm wavelength is observed for a 10-cm long fan-out waveguide.
AB - Single-mode polymer optical waveguides with circular cores are successfully fabricated using the Mosquito method. Furthermore, fabrication conditions for densely aligned waveguides having graded-index circular cores with a 25-μm diameter are also investigated, in which the inter-channel pitch is reduced to 60 μm. By applying the three-dimensional (3-D) alignment conditions with the Mosquito method, fan-out waveguides are fabricated: three cores are obliquely aligned with a 40-μm pitch, while at the other end, the three cores are horizontally aligned in line with a 250-μm pitch. The insertion loss as low as 2.85 dB at 850-nm wavelength is observed for a 10-cm long fan-out waveguide.
KW - fan-out device
KW - optical interconnects
KW - polymer optical waveguides
KW - single-mode waveguide
KW - the Mosquito method
UR - http://www.scopus.com/inward/record.url?scp=84903731431&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84903731431&partnerID=8YFLogxK
U2 - 10.1109/ICEP.2014.6826767
DO - 10.1109/ICEP.2014.6826767
M3 - Conference contribution
AN - SCOPUS:84903731431
SN - 9784904090107
T3 - 2014 International Conference on Electronics Packaging, ICEP 2014
SP - 689
EP - 693
BT - 2014 International Conference on Electronics Packaging, ICEP 2014
PB - IEEE Computer Society
T2 - 2014 International Conference on Electronics Packaging, ICEP 2014
Y2 - 23 April 2014 through 25 April 2014
ER -