High efficiency precision surface grinding of fused silica

Peng Yao, Yadong Gong, Suoxian Yuan, Nobuhito Yoshihara, Jiwang Yan, Tsunemoto Kuriyagawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages1132-1136
Number of pages5
Volume418-420
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011 - Guilin, China
Duration: 2011 Dec 162011 Dec 18

Publication series

NameAdvanced Materials Research
Volume418-420
ISSN (Print)10226680

Other

Other2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011
CountryChina
CityGuilin
Period11/12/1611/12/18

Fingerprint

Fused silica
Creep
Wheels
Resins
Surface roughness
Ultraviolet lasers
Elasticity
Lenses
Diamonds
Experiments
Wear of materials

Keywords

  • Creep feed grinding
  • Fused silica
  • Undeformed chip thickness
  • Wheel wear

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Yao, P., Gong, Y., Yuan, S., Yoshihara, N., Yan, J., & Kuriyagawa, T. (2012). High efficiency precision surface grinding of fused silica. In Advanced Materials Research (Vol. 418-420, pp. 1132-1136). (Advanced Materials Research; Vol. 418-420). https://doi.org/10.4028/www.scientific.net/AMR.418-420.1132

High efficiency precision surface grinding of fused silica. / Yao, Peng; Gong, Yadong; Yuan, Suoxian; Yoshihara, Nobuhito; Yan, Jiwang; Kuriyagawa, Tsunemoto.

Advanced Materials Research. Vol. 418-420 2012. p. 1132-1136 (Advanced Materials Research; Vol. 418-420).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yao, P, Gong, Y, Yuan, S, Yoshihara, N, Yan, J & Kuriyagawa, T 2012, High efficiency precision surface grinding of fused silica. in Advanced Materials Research. vol. 418-420, Advanced Materials Research, vol. 418-420, pp. 1132-1136, 2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011, Guilin, China, 11/12/16. https://doi.org/10.4028/www.scientific.net/AMR.418-420.1132
Yao P, Gong Y, Yuan S, Yoshihara N, Yan J, Kuriyagawa T. High efficiency precision surface grinding of fused silica. In Advanced Materials Research. Vol. 418-420. 2012. p. 1132-1136. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.418-420.1132
Yao, Peng ; Gong, Yadong ; Yuan, Suoxian ; Yoshihara, Nobuhito ; Yan, Jiwang ; Kuriyagawa, Tsunemoto. / High efficiency precision surface grinding of fused silica. Advanced Materials Research. Vol. 418-420 2012. pp. 1132-1136 (Advanced Materials Research).
@inproceedings{2ac139a74d814e8aa2b82d73a264b2f1,
title = "High efficiency precision surface grinding of fused silica",
abstract = "High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.",
keywords = "Creep feed grinding, Fused silica, Undeformed chip thickness, Wheel wear",
author = "Peng Yao and Yadong Gong and Suoxian Yuan and Nobuhito Yoshihara and Jiwang Yan and Tsunemoto Kuriyagawa",
year = "2012",
doi = "10.4028/www.scientific.net/AMR.418-420.1132",
language = "English",
isbn = "9783037853269",
volume = "418-420",
series = "Advanced Materials Research",
pages = "1132--1136",
booktitle = "Advanced Materials Research",

}

TY - GEN

T1 - High efficiency precision surface grinding of fused silica

AU - Yao, Peng

AU - Gong, Yadong

AU - Yuan, Suoxian

AU - Yoshihara, Nobuhito

AU - Yan, Jiwang

AU - Kuriyagawa, Tsunemoto

PY - 2012

Y1 - 2012

N2 - High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.

AB - High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.

KW - Creep feed grinding

KW - Fused silica

KW - Undeformed chip thickness

KW - Wheel wear

UR - http://www.scopus.com/inward/record.url?scp=84857979488&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84857979488&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMR.418-420.1132

DO - 10.4028/www.scientific.net/AMR.418-420.1132

M3 - Conference contribution

SN - 9783037853269

VL - 418-420

T3 - Advanced Materials Research

SP - 1132

EP - 1136

BT - Advanced Materials Research

ER -