High-performance packaging technology for ultra-high-speed ATM switching system

Katsumi Kaizu, Tohru Kishimoto, Shinich Sasaki, Naoaki Yamanaka, Kouichi Genda

Research output: Contribution to journalArticle

Abstract

This paper describes high-performance, high-density multichip modules (MCMs) using a copper polyimide multi-layer substrate and innovative heat-pipe cooling for high-speed ATM switching system. High-speed ATM link wires are interconnected on the top surface of the MCMs by the newly developed flexible printed circuit cables and connectors to reduce the rear-side I/O count and achieve 620-Mbit/s 32-bit parallel interconnection. A heat-pipe is attached to the back surface of each MCM to cool the power dissipation, which is 30 W per MCM. With a 2-m/s forced airflow, a prototype ATM switch system operated at 320 Gbit/s (with 8×8 MCMs) with a maximum junction temperature of less than 85 °C. These results indicate that this technology is suitable for future B-ISDN high-speed swithing systems.

Original languageEnglish
Pages (from-to)863-871
Number of pages9
JournalNTT R and D
Volume45
Issue number9
Publication statusPublished - 1996
Externally publishedYes

Fingerprint

Multichip modules
Switching systems
Automatic teller machines
Packaging
Heat pipes
Printed circuits
Voice/data communication systems
Polyimides
Telecommunication links
Energy dissipation
Cables
Switches
Wire
Cooling
Copper
Substrates

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kaizu, K., Kishimoto, T., Sasaki, S., Yamanaka, N., & Genda, K. (1996). High-performance packaging technology for ultra-high-speed ATM switching system. NTT R and D, 45(9), 863-871.

High-performance packaging technology for ultra-high-speed ATM switching system. / Kaizu, Katsumi; Kishimoto, Tohru; Sasaki, Shinich; Yamanaka, Naoaki; Genda, Kouichi.

In: NTT R and D, Vol. 45, No. 9, 1996, p. 863-871.

Research output: Contribution to journalArticle

Kaizu, K, Kishimoto, T, Sasaki, S, Yamanaka, N & Genda, K 1996, 'High-performance packaging technology for ultra-high-speed ATM switching system', NTT R and D, vol. 45, no. 9, pp. 863-871.
Kaizu, Katsumi ; Kishimoto, Tohru ; Sasaki, Shinich ; Yamanaka, Naoaki ; Genda, Kouichi. / High-performance packaging technology for ultra-high-speed ATM switching system. In: NTT R and D. 1996 ; Vol. 45, No. 9. pp. 863-871.
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