High-performance packaging technology for very-high-speed ATM switching systems

Katsumi Kaizu, Tohru Kishimoto, Shin Ichi Sasaki, Naoaki Yamanaka, Kouichi Genda

Research output: Contribution to journalArticle

Abstract

This paper describes high-performance, high-density multichip modules (MCMs) using a copper polymide multi-layer substrate and innovative heat-pipe cooling for high-speed ATM switching systems. High-speed ATM link wires are interconnected on the top surface of the MCMs by the newly developed flexible printed circuit cables and con-nectors to reduce the rear-side I/O count and achieve 620-Mbit/s 32-bit parallel interconnections. A heat-pipe is attached to the back surface of each MCM to cool the power dissipation, which is 30 W per MCM. With a 2-m/s forced air flow, a prototype ATM switch system operated at 320 Gbit/s (with 8 × 8 MCMs) with a maximum junction temperature of less than 85 °C. These results indicate that this technology is suitable for future B-ISDN high-speed switching systems.

Original languageEnglish
Pages (from-to)36-45
Number of pages10
JournalNTT Review
Volume9
Issue number2
Publication statusPublished - 1997 Mar
Externally publishedYes

Fingerprint

Multichip modules
Switching systems
Automatic teller machines
Packaging
Heat pipes
Printed circuits
Voice/data communication systems
Telecommunication links
Energy dissipation
Cables
Switches
Wire
Cooling
Copper
Substrates
Air

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications

Cite this

Kaizu, K., Kishimoto, T., Sasaki, S. I., Yamanaka, N., & Genda, K. (1997). High-performance packaging technology for very-high-speed ATM switching systems. NTT Review, 9(2), 36-45.

High-performance packaging technology for very-high-speed ATM switching systems. / Kaizu, Katsumi; Kishimoto, Tohru; Sasaki, Shin Ichi; Yamanaka, Naoaki; Genda, Kouichi.

In: NTT Review, Vol. 9, No. 2, 03.1997, p. 36-45.

Research output: Contribution to journalArticle

Kaizu, K, Kishimoto, T, Sasaki, SI, Yamanaka, N & Genda, K 1997, 'High-performance packaging technology for very-high-speed ATM switching systems', NTT Review, vol. 9, no. 2, pp. 36-45.
Kaizu, Katsumi ; Kishimoto, Tohru ; Sasaki, Shin Ichi ; Yamanaka, Naoaki ; Genda, Kouichi. / High-performance packaging technology for very-high-speed ATM switching systems. In: NTT Review. 1997 ; Vol. 9, No. 2. pp. 36-45.
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