High-precision analysis of internal deformation/fracture characteristics of a material by using submicron 3D CT images

Mitsuru Nakazawa, Masakazu Kobayashi, Hiroyuki Toda, Yoshimitsu Aoki

    Research output: Contribution to journalArticle

    Abstract

    In material engineering, it is widely recognized that deformation and fracture (D/F) characteristics are important because the safety of developed materials can be determined on the basis of D/F characteristics. The D/F characteristic is defined as the load required to break the material and the strain caused by applying a particular load. To observe the effect of grain boundary slip at the micron level, we have proposed a method of obtaining displacement vectors of internal structures from submicron 3D CT images. In this paper, we introduce an improved method for accurately acquiring D/F characteristics. The results of a simulation and a real test confirm the effectiveness of the improved method.

    Original languageEnglish
    Pages (from-to)548-556+17
    Journalieej transactions on industry applications
    Volume131
    Issue number4
    DOIs
    Publication statusPublished - 2011 Sep 9

    Keywords

    • 3D CT
    • Material evaluation
    • Mismatch-detection
    • PTV
    • Submicron analysis

    ASJC Scopus subject areas

    • Industrial and Manufacturing Engineering
    • Electrical and Electronic Engineering

    Fingerprint Dive into the research topics of 'High-precision analysis of internal deformation/fracture characteristics of a material by using submicron 3D CT images'. Together they form a unique fingerprint.

    Cite this