High-precision analysis of internal deformation/fracture characteristics of a material by using submicron 3D CT images

Mitsuru Nakazawa, Masakazu Kobayashi, Hiroyuki Toda, Yoshimitsu Aoki

Research output: Contribution to journalArticle

Abstract

In material engineering, it is widely recognized that deformation and fracture (D/F) characteristics are important because the safety of developed materials can be determined on the basis of D/F characteristics. The D/F characteristic is defined as the load required to break the material and the strain caused by applying a particular load. To observe the effect of grain boundary slip at the micron level, we have proposed a method of obtaining displacement vectors of internal structures from submicron 3D CT images. In this paper, we introduce an improved method for accurately acquiring D/F characteristics. The results of a simulation and a real test confirm the effectiveness of the improved method.

Original languageEnglish
Pages (from-to)548-556+17
Journalieej transactions on industry applications
Volume131
Issue number4
DOIs
Publication statusPublished - 2011 Sep 9

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Keywords

  • 3D CT
  • Material evaluation
  • Mismatch-detection
  • PTV
  • Submicron analysis

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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