Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer

Masayuki Ikebe; Daisuke Uchida; Yasuhiro Take; Makito Someya; Satoshi Chikuda; Kento Matsuyama; Tetsuya Asai; Tadahiro Kuroda; Masato Motomura

doi:10.1109/VLSIC.2015.7231331

Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer

Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming TDC used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.

Original language	English
Title of host publication	IEEE Symposium on VLSI Circuits, Digest of Technical Papers
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	C82-C83
Volume	2015-August
ISBN (Print)	9784863485020
DOIs	https://doi.org/10.1109/VLSIC.2015.7231331
Publication status	Published - 2015 Aug 31
Event	29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015 - Kyoto, Japan Duration: 2015 Jun 17 → 2015 Jun 19

Other

Other	29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015
Country/Territory	Japan
City	Kyoto
Period	15/6/17 → 15/6/19

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/VLSIC.2015.7231331

Cite this

Ikebe, M., Uchida, D., Take, Y., Someya, M., Chikuda, S., Matsuyama, K., Asai, T., Kuroda, T., & Motomura, M. (2015). Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer. In IEEE Symposium on VLSI Circuits, Digest of Technical Papers (Vol. 2015-August, pp. C82-C83). [7231331] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VLSIC.2015.7231331

Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer. / Ikebe, Masayuki; Uchida, Daisuke; Take, Yasuhiro et al.

IEEE Symposium on VLSI Circuits, Digest of Technical Papers. Vol. 2015-August Institute of Electrical and Electronics Engineers Inc., 2015. p. C82-C83 7231331.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ikebe, M, Uchida, D, Take, Y, Someya, M, Chikuda, S, Matsuyama, K, Asai, T, Kuroda, T & Motomura, M 2015, Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer. in IEEE Symposium on VLSI Circuits, Digest of Technical Papers. vol. 2015-August, 7231331, Institute of Electrical and Electronics Engineers Inc., pp. C82-C83, 29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015, Kyoto, Japan, 15/6/17. https://doi.org/10.1109/VLSIC.2015.7231331

Ikebe M, Uchida D, Take Y, Someya M, Chikuda S, Matsuyama K et al. Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer. In IEEE Symposium on VLSI Circuits, Digest of Technical Papers. Vol. 2015-August. Institute of Electrical and Electronics Engineers Inc. 2015. p. C82-C83. 7231331 doi: 10.1109/VLSIC.2015.7231331

@inproceedings{22dde2b9285545d6a187bffd109fa131,

title = "Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer",

abstract = "This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming TDC used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.",

author = "Masayuki Ikebe and Daisuke Uchida and Yasuhiro Take and Makito Someya and Satoshi Chikuda and Kento Matsuyama and Tetsuya Asai and Tadahiro Kuroda and Masato Motomura",

year = "2015",

month = aug,

day = "31",

doi = "10.1109/VLSIC.2015.7231331",

language = "English",

isbn = "9784863485020",

volume = "2015-August",

pages = "C82--C83",

booktitle = "IEEE Symposium on VLSI Circuits, Digest of Technical Papers",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015 ; Conference date: 17-06-2015 Through 19-06-2015",

}

TY - GEN

T1 - Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer

AU - Ikebe, Masayuki

AU - Uchida, Daisuke

AU - Take, Yasuhiro

AU - Someya, Makito

AU - Chikuda, Satoshi

AU - Matsuyama, Kento

AU - Asai, Tetsuya

AU - Kuroda, Tadahiro

AU - Motomura, Masato

PY - 2015/8/31

Y1 - 2015/8/31

N2 - This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming TDC used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.

AB - This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming TDC used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.

UR - http://www.scopus.com/inward/record.url?scp=84957875195&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84957875195&partnerID=8YFLogxK

U2 - 10.1109/VLSIC.2015.7231331

DO - 10.1109/VLSIC.2015.7231331

M3 - Conference contribution

AN - SCOPUS:84957875195

SN - 9784863485020

VL - 2015-August

SP - C82-C83

BT - IEEE Symposium on VLSI Circuits, Digest of Technical Papers

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015

Y2 - 17 June 2015 through 19 June 2015

ER -

Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer

Abstract

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this