Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer

Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming TDC used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.

Original languageEnglish
Title of host publicationIEEE Symposium on VLSI Circuits, Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
PagesC82-C83
Volume2015-August
ISBN (Print)9784863485020
DOIs
Publication statusPublished - 2015 Aug 31
Event29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015 - Kyoto, Japan
Duration: 2015 Jun 172015 Jun 19

Other

Other29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015
CountryJapan
CityKyoto
Period15/6/1715/6/19

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Ikebe, M., Uchida, D., Take, Y., Someya, M., Chikuda, S., Matsuyama, K., Asai, T., Kuroda, T., & Motomura, M. (2015). Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer. In IEEE Symposium on VLSI Circuits, Digest of Technical Papers (Vol. 2015-August, pp. C82-C83). [7231331] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VLSIC.2015.7231331