Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer

Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    5 Citations (Scopus)

    Abstract

    This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming TDC used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.

    Original languageEnglish
    Title of host publicationIEEE Symposium on VLSI Circuits, Digest of Technical Papers
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    PagesC82-C83
    Volume2015-August
    ISBN (Print)9784863485020
    DOIs
    Publication statusPublished - 2015 Aug 31
    Event29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015 - Kyoto, Japan
    Duration: 2015 Jun 172015 Jun 19

    Other

    Other29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015
    CountryJapan
    CityKyoto
    Period15/6/1715/6/19

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials

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