Improvement in electrical properties of carbon nanotube via interconnects

Masayuki Katagiri, Yuichi Yamazaki, Makoto Wada, Masayuki Kitamura, Naoshi Sakuma, Mariko Suzuki, Shintaro Sato, Mizuhisa Nihei, Akihiro Kajita, Tadashi Sakai, Yuji Awano

    Research output: Contribution to journalArticlepeer-review

    19 Citations (Scopus)

    Abstract

    We report on the electrical properties of carbon nanotube (CNT) via interconnects with improvement in contact formations between the CNT via and metal electrodes. For the improvement of the bottom contact formation, a TiN/TaN multilayer on a Cu bottom wiring layer is applied to suppress formation of a highly resistive oxide layer on the TaN barrier layer. The top electrode formation with good coverage on CNTs reduces contact resistance. The current-voltage characteristics of ultrafine CNT via interconnects exhibit ohmic behavior. The resistance of the CNT via interconnect is inversely proportional to the via area, indicating that the CNT bundles are grown with uniform quality and density in variousdiameter via holes.

    Original languageEnglish
    Article number05EF01
    JournalJapanese journal of applied physics
    Volume50
    Issue number5 PART 2
    DOIs
    Publication statusPublished - 2011 May 1

    ASJC Scopus subject areas

    • Engineering(all)
    • Physics and Astronomy(all)

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