Improvement in electrical properties of carbon nanotube via interconnects

Masayuki Katagiri, Yuichi Yamazaki, Makoto Wada, Masayuki Kitamura, Naoshi Sakuma, Mariko Suzuki, Shintaro Sato, Mizuhisa Nihei, Akihiro Kajita, Tadashi Sakai, Yuji Awano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report on the electrical properties of carbon nanotube (CNT) via interconnects with improvement in contact formations between CNTs and metal electrodes. For the improvement of the bottom contact, formation processes of barrier layers on a Cu wiring layer are optimized. The current-voltage characteristics of ultrafine CNT via interconnects exhibit ohmic properties. The resistance of the CNT via is inversely proportional to the via area, indicating good uniformity of the CNT growth in the via.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference 2010
Pages152-153
Number of pages2
Publication statusPublished - 2010 Dec 1
Externally publishedYes
EventAdvanced Metallization Conference 2010 - Albany, NY, United States
Duration: 2010 Oct 52010 Oct 7

Publication series

NameAdvanced Metallization Conference (AMC)
ISSN (Print)1540-1766

Other

OtherAdvanced Metallization Conference 2010
CountryUnited States
CityAlbany, NY
Period10/10/510/10/7

ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

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  • Cite this

    Katagiri, M., Yamazaki, Y., Wada, M., Kitamura, M., Sakuma, N., Suzuki, M., Sato, S., Nihei, M., Kajita, A., Sakai, T., & Awano, Y. (2010). Improvement in electrical properties of carbon nanotube via interconnects. In Advanced Metallization Conference 2010 (pp. 152-153). (Advanced Metallization Conference (AMC)).