Abstract
Thermal damage of the ground surface is one of the most serious problems in creep feed grinding. Loading of chips on the grinding wheel surface causes an increase of heat generation in the grinding process and disturbs efficient application of grinding fluid because of the decrease of chip pocket volume. In this study an ultrasonic cleaning method was applied to remove the loading chips from the wheel during the grinding process. The effect of this new method on the reduction of grinding power consumption as well as on the reduction of grinding temperature was confirmed through the experiments. (from English abstract)
| Original language | English |
|---|---|
| Pages (from-to) | 1239-1243 |
| Number of pages | 5 |
| Journal | J. JAPAN SOC. PRECIS. ENGNG. |
| Volume | 50 |
| Issue number | 8 , Aug. 1984 |
| Publication status | Published - 1984 |
| Externally published | Yes |
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ASJC Scopus subject areas
- Engineering(all)
Cite this
Improvement of grinding fluid application in creep feed grinding. Removal of loading chips on grinding wheel surface by means of ultrasonic cleaning. / Tsunasawa, Y.; Aoyama, Hideki; Aoyama, Tojiro; Inasaki, I.
In: J. JAPAN SOC. PRECIS. ENGNG., Vol. 50, No. 8 , Aug. 1984, 1984, p. 1239-1243.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Improvement of grinding fluid application in creep feed grinding. Removal of loading chips on grinding wheel surface by means of ultrasonic cleaning.
AU - Tsunasawa, Y.
AU - Aoyama, Hideki
AU - Aoyama, Tojiro
AU - Inasaki, I.
PY - 1984
Y1 - 1984
N2 - Thermal damage of the ground surface is one of the most serious problems in creep feed grinding. Loading of chips on the grinding wheel surface causes an increase of heat generation in the grinding process and disturbs efficient application of grinding fluid because of the decrease of chip pocket volume. In this study an ultrasonic cleaning method was applied to remove the loading chips from the wheel during the grinding process. The effect of this new method on the reduction of grinding power consumption as well as on the reduction of grinding temperature was confirmed through the experiments. (from English abstract)
AB - Thermal damage of the ground surface is one of the most serious problems in creep feed grinding. Loading of chips on the grinding wheel surface causes an increase of heat generation in the grinding process and disturbs efficient application of grinding fluid because of the decrease of chip pocket volume. In this study an ultrasonic cleaning method was applied to remove the loading chips from the wheel during the grinding process. The effect of this new method on the reduction of grinding power consumption as well as on the reduction of grinding temperature was confirmed through the experiments. (from English abstract)
UR - http://www.scopus.com/inward/record.url?scp=0021198717&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0021198717&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:0021198717
VL - 50
SP - 1239
EP - 1243
JO - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
JF - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
SN - 0912-0289
IS - 8 , Aug. 1984
ER -