Improvement of grinding fluid application in creep feed grinding. Removal of loading chips on grinding wheel surface by means of ultrasonic cleaning.

Y. Tsunasawa, H. Aoyama, T. Aoyama, I. Inasaki

Research output: Contribution to journalArticle


Thermal damage of the ground surface is one of the most serious problems in creep feed grinding. Loading of chips on the grinding wheel surface causes an increase of heat generation in the grinding process and disturbs efficient application of grinding fluid because of the decrease of chip pocket volume. In this study an ultrasonic cleaning method was applied to remove the loading chips from the wheel during the grinding process. The effect of this new method on the reduction of grinding power consumption as well as on the reduction of grinding temperature was confirmed through the experiments. (from English abstract)

Original languageEnglish
Pages (from-to)1239-1243
Number of pages5
Issue number8 , Aug. 1984
Publication statusPublished - 1984 Jan 1
Externally publishedYes


ASJC Scopus subject areas

  • Mechanical Engineering

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