Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

Xijun Kang, Jim'ichi Tamaki, Akihiko Kubo, Jiwang Yan, Toshirou Iyama

Research output: Contribution to conferencePaper

Abstract

Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

Original languageEnglish
Pages193-198
Number of pages6
Publication statusPublished - 2005 Dec 1
Externally publishedYes
Event3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005 - Nagoya, Japan
Duration: 2005 Oct 192005 Oct 22

Other

Other3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005
CountryJapan
CityNagoya
Period05/10/1905/10/22

Keywords

  • Cutting edge truncation
  • Metal-bonded grinding wheel
  • Optical material
  • Quartz
  • Silicon

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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