Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

Xijun Kang, Jim'ichi Tamaki, Akihiko Kubo, Jiwang Yan, Toshirou Iyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

Original languageEnglish
Title of host publicationLEM 2005 - 3rd International Conference on Leading Edge Manufacturing in 21st Century
Pages193-198
Number of pages6
Publication statusPublished - 2005
Externally publishedYes
Event3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005 - Nagoya, Japan
Duration: 2005 Oct 192005 Oct 22

Other

Other3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005
CountryJapan
CityNagoya
Period05/10/1905/10/22

Fingerprint

Diamond cutting tools
Optical materials
Grinding wheels
Surface roughness
Quartz
Metals
Surface morphology
Glass
Silicon

Keywords

  • Cutting edge truncation
  • Metal-bonded grinding wheel
  • Optical material
  • Quartz
  • Silicon

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

Cite this

Kang, X., Tamaki, J., Kubo, A., Yan, J., & Iyama, T. (2005). Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel. In LEM 2005 - 3rd International Conference on Leading Edge Manufacturing in 21st Century (pp. 193-198)

Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel. / Kang, Xijun; Tamaki, Jim'ichi; Kubo, Akihiko; Yan, Jiwang; Iyama, Toshirou.

LEM 2005 - 3rd International Conference on Leading Edge Manufacturing in 21st Century. 2005. p. 193-198.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kang, X, Tamaki, J, Kubo, A, Yan, J & Iyama, T 2005, Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel. in LEM 2005 - 3rd International Conference on Leading Edge Manufacturing in 21st Century. pp. 193-198, 3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005, Nagoya, Japan, 05/10/19.
Kang X, Tamaki J, Kubo A, Yan J, Iyama T. Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel. In LEM 2005 - 3rd International Conference on Leading Edge Manufacturing in 21st Century. 2005. p. 193-198
Kang, Xijun ; Tamaki, Jim'ichi ; Kubo, Akihiko ; Yan, Jiwang ; Iyama, Toshirou. / Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel. LEM 2005 - 3rd International Conference on Leading Edge Manufacturing in 21st Century. 2005. pp. 193-198
@inproceedings{75ce9f56390d4c1dbe61911496b40b98,
title = "Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel",
abstract = "Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.",
keywords = "Cutting edge truncation, Metal-bonded grinding wheel, Optical material, Quartz, Silicon",
author = "Xijun Kang and Jim'ichi Tamaki and Akihiko Kubo and Jiwang Yan and Toshirou Iyama",
year = "2005",
language = "English",
pages = "193--198",
booktitle = "LEM 2005 - 3rd International Conference on Leading Edge Manufacturing in 21st Century",

}

TY - GEN

T1 - Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

AU - Kang, Xijun

AU - Tamaki, Jim'ichi

AU - Kubo, Akihiko

AU - Yan, Jiwang

AU - Iyama, Toshirou

PY - 2005

Y1 - 2005

N2 - Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

AB - Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

KW - Cutting edge truncation

KW - Metal-bonded grinding wheel

KW - Optical material

KW - Quartz

KW - Silicon

UR - http://www.scopus.com/inward/record.url?scp=84883692183&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84883692183&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84883692183

SP - 193

EP - 198

BT - LEM 2005 - 3rd International Conference on Leading Edge Manufacturing in 21st Century

ER -