Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

Xijun Kang; Jim'ichi Tamaki; Akihiko Kubo; Jiwang Yan; Toshirou Iyama

Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

Xijun Kang, Jim'ichi Tamaki, Akihiko Kubo, Jiwang Yan, Toshirou Iyama

Research output: Contribution to conference › Paper › peer-review

Abstract

Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

Original language	English
Pages	193-198
Number of pages	6
Publication status	Published - 2005 Dec 1
Externally published	Yes
Event	3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005 - Nagoya, Japan Duration: 2005 Oct 19 → 2005 Oct 22

Other

Other	3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005
Country/Territory	Japan
City	Nagoya
Period	05/10/19 → 05/10/22

Keywords

Cutting edge truncation
Metal-bonded grinding wheel
Optical material
Quartz
Silicon

ASJC Scopus subject areas

Industrial and Manufacturing Engineering

Cite this

Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel. / Kang, Xijun; Tamaki, Jim'ichi; Kubo, Akihiko et al.
2005. 193-198 Paper presented at 3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005, Nagoya, Japan.

Research output: Contribution to conference › Paper › peer-review

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title = "Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel",

abstract = "Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.",

keywords = "Cutting edge truncation, Metal-bonded grinding wheel, Optical material, Quartz, Silicon",

author = "Xijun Kang and Jim'ichi Tamaki and Akihiko Kubo and Jiwang Yan and Toshirou Iyama",

year = "2005",

month = dec,

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language = "English",

pages = "193--198",

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TY - CONF

T1 - Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

AU - Kang, Xijun

AU - Tamaki, Jim'ichi

AU - Kubo, Akihiko

AU - Yan, Jiwang

AU - Iyama, Toshirou

PY - 2005/12/1

Y1 - 2005/12/1

N2 - Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

AB - Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

KW - Cutting edge truncation

KW - Metal-bonded grinding wheel

KW - Optical material

KW - Quartz

KW - Silicon

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M3 - Paper

AN - SCOPUS:84883692183

SP - 193

EP - 198

T2 - 3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005

Y2 - 19 October 2005 through 22 October 2005

ER -

Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

Abstract

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Keywords

ASJC Scopus subject areas

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