In-Plane Gyroscope Using a Piezoresistive Beams with Sidewall Doping

Kosuke Abe, Hidetoshi Takahashi, Tomoyuki Takahata, Isao Shimoyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports a gyroscope using sidewall doped piezoresistors and vibrating mass by Lorentz force. With sidewall doped piezoresistors, in-plane deformation of the beams due to Coriolis force generated by angular motion can be detected, which was difficult with surface doped piezoresistors. The proposed gyroscope was designed so that the resonant frequencies of the driving and sensing modes were similar to each other. It was demonstrated that the developed gyroscope measured angular velocity through the resistance change of the piezoresistive beams.

Original languageEnglish
Title of host publication2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages680-683
Number of pages4
ISBN (Electronic)9781728116105
DOIs
Publication statusPublished - 2019 Jan
Externally publishedYes
Event32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019 - Seoul, Korea, Republic of
Duration: 2019 Jan 272019 Jan 31

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2019-January
ISSN (Print)1084-6999

Conference

Conference32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
CountryKorea, Republic of
CitySeoul
Period19/1/2719/1/31

Fingerprint

Gyroscopes
gyroscopes
Doping (additives)
angular velocity
Coriolis force
Lorentz force
Angular velocity
resonant frequencies
Natural frequencies

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Abe, K., Takahashi, H., Takahata, T., & Shimoyama, I. (2019). In-Plane Gyroscope Using a Piezoresistive Beams with Sidewall Doping. In 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019 (pp. 680-683). [8870841] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2019-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2019.8870841

In-Plane Gyroscope Using a Piezoresistive Beams with Sidewall Doping. / Abe, Kosuke; Takahashi, Hidetoshi; Takahata, Tomoyuki; Shimoyama, Isao.

2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 680-683 8870841 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2019-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abe, K, Takahashi, H, Takahata, T & Shimoyama, I 2019, In-Plane Gyroscope Using a Piezoresistive Beams with Sidewall Doping. in 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019., 8870841, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), vol. 2019-January, Institute of Electrical and Electronics Engineers Inc., pp. 680-683, 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019, Seoul, Korea, Republic of, 19/1/27. https://doi.org/10.1109/MEMSYS.2019.8870841
Abe K, Takahashi H, Takahata T, Shimoyama I. In-Plane Gyroscope Using a Piezoresistive Beams with Sidewall Doping. In 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 680-683. 8870841. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2019.8870841
Abe, Kosuke ; Takahashi, Hidetoshi ; Takahata, Tomoyuki ; Shimoyama, Isao. / In-Plane Gyroscope Using a Piezoresistive Beams with Sidewall Doping. 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 680-683 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).
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