Inductive-coupling interfaces for high-speed low-power proximity communications

Hayun Chung, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Inductive-coupling interfaces provide high-speed, low-power and cost-efficient solutions in proximity communications. Synchronous pulse-based inductive-coupling transceivers have been applied to a wide range of applications, such as through-chip interface, non-contact memory and wafer-level testing.

Original languageEnglish
Title of host publicationMidwest Symposium on Circuits and Systems
DOIs
Publication statusPublished - 2011
Event54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011 - Seoul, Korea, Republic of
Duration: 2011 Aug 72011 Aug 10

Other

Other54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011
CountryKorea, Republic of
CitySeoul
Period11/8/711/8/10

Fingerprint

Transceivers
Interfaces (computer)
Data storage equipment
Communication
Testing
Costs

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Inductive-coupling interfaces for high-speed low-power proximity communications. / Chung, Hayun; Kuroda, Tadahiro.

Midwest Symposium on Circuits and Systems. 2011. 6026621.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chung, H & Kuroda, T 2011, Inductive-coupling interfaces for high-speed low-power proximity communications. in Midwest Symposium on Circuits and Systems., 6026621, 54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011, Seoul, Korea, Republic of, 11/8/7. https://doi.org/10.1109/MWSCAS.2011.6026621
Chung, Hayun ; Kuroda, Tadahiro. / Inductive-coupling interfaces for high-speed low-power proximity communications. Midwest Symposium on Circuits and Systems. 2011.
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