Inductive-coupling transceiver for 3D system integration

Noriyuki Miura, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents recent achievements of a high-bandwidth and low-energy inductive-coupling transceiver. First, a lTb/s 2.8pJ/b transceiver in 180nm CMOS is presented. Both clock and data are transmitted by inductive coupling at a clock rate of 1GHz and a data rate of lGb/s. 1024 data transceivers are arranged with a pitch of 30μm in 1mm2 where 4-phase Time Division Multiplexing (TDM) reduces crosstalk between channels. Measured Bit Error Rate (BER) is lower than 10-12. Second, a 0.14pJ/b transceiver in 90nm CMOS is presented. A digital pulse shaping reduces the transmitter's energy dissipation to 0.11pJ/b. Device scaling reduces the receiver's energy dissipation to 0.03pJ/b. The overall energy dissipation is 20X lower than the first transceiver without degrading the data rate and BER.

Original languageEnglish
Title of host publicationProceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT
Pages172-175
Number of pages4
DOIs
Publication statusPublished - 2007
Event2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT - Austin, TX, United States
Duration: 2007 May 302007 Jun 1

Other

Other2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT
CountryUnited States
CityAustin, TX
Period07/5/3007/6/1

Fingerprint

Transceivers
Energy dissipation
Bit error rate
Clocks
Pulse shaping
Time division multiplexing
Crosstalk
Transmitters
Bandwidth

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Miura, N., & Kuroda, T. (2007). Inductive-coupling transceiver for 3D system integration. In Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT (pp. 172-175). [4299566] https://doi.org/10.1109/ICICDT.2007.4299566

Inductive-coupling transceiver for 3D system integration. / Miura, Noriyuki; Kuroda, Tadahiro.

Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT. 2007. p. 172-175 4299566.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miura, N & Kuroda, T 2007, Inductive-coupling transceiver for 3D system integration. in Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT., 4299566, pp. 172-175, 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT, Austin, TX, United States, 07/5/30. https://doi.org/10.1109/ICICDT.2007.4299566
Miura N, Kuroda T. Inductive-coupling transceiver for 3D system integration. In Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT. 2007. p. 172-175. 4299566 https://doi.org/10.1109/ICICDT.2007.4299566
Miura, Noriyuki ; Kuroda, Tadahiro. / Inductive-coupling transceiver for 3D system integration. Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT. 2007. pp. 172-175
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