Inductive-coupling transceiver for 3D system integration

Noriyuki Miura; Tadahiro Kuroda

doi:10.1109/ICICDT.2007.4299566

Inductive-coupling transceiver for 3D system integration

Noriyuki Miura, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This paper presents recent achievements of a high-bandwidth and low-energy inductive-coupling transceiver. First, a lTb/s 2.8pJ/b transceiver in 180nm CMOS is presented. Both clock and data are transmitted by inductive coupling at a clock rate of 1GHz and a data rate of lGb/s. 1024 data transceivers are arranged with a pitch of 30μm in 1mm² where 4-phase Time Division Multiplexing (TDM) reduces crosstalk between channels. Measured Bit Error Rate (BER) is lower than 10^-12. Second, a 0.14pJ/b transceiver in 90nm CMOS is presented. A digital pulse shaping reduces the transmitter's energy dissipation to 0.11pJ/b. Device scaling reduces the receiver's energy dissipation to 0.03pJ/b. The overall energy dissipation is 20X lower than the first transceiver without degrading the data rate and BER.

Original language	English
Title of host publication	Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT
Pages	172-175
Number of pages	4
DOIs	https://doi.org/10.1109/ICICDT.2007.4299566
Publication status	Published - 2007
Externally published	Yes
Event	2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT - Austin, TX, United States Duration: 2007 May 30 → 2007 Jun 1

Publication series

Name	Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT

Other

Other	2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT
Country/Territory	United States
City	Austin, TX
Period	07/5/30 → 07/6/1

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ICICDT.2007.4299566

Cite this

Inductive-coupling transceiver for 3D system integration. / Miura, Noriyuki; Kuroda, Tadahiro.
Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT. 2007. p. 172-175 4299566 (Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Miura, N & Kuroda, T 2007, Inductive-coupling transceiver for 3D system integration. in Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT., 4299566, Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT, pp. 172-175, 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT, Austin, TX, United States, 07/5/30. https://doi.org/10.1109/ICICDT.2007.4299566

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abstract = "This paper presents recent achievements of a high-bandwidth and low-energy inductive-coupling transceiver. First, a lTb/s 2.8pJ/b transceiver in 180nm CMOS is presented. Both clock and data are transmitted by inductive coupling at a clock rate of 1GHz and a data rate of lGb/s. 1024 data transceivers are arranged with a pitch of 30μm in 1mm2 where 4-phase Time Division Multiplexing (TDM) reduces crosstalk between channels. Measured Bit Error Rate (BER) is lower than 10-12. Second, a 0.14pJ/b transceiver in 90nm CMOS is presented. A digital pulse shaping reduces the transmitter's energy dissipation to 0.11pJ/b. Device scaling reduces the receiver's energy dissipation to 0.03pJ/b. The overall energy dissipation is 20X lower than the first transceiver without degrading the data rate and BER.",

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AB - This paper presents recent achievements of a high-bandwidth and low-energy inductive-coupling transceiver. First, a lTb/s 2.8pJ/b transceiver in 180nm CMOS is presented. Both clock and data are transmitted by inductive coupling at a clock rate of 1GHz and a data rate of lGb/s. 1024 data transceivers are arranged with a pitch of 30μm in 1mm2 where 4-phase Time Division Multiplexing (TDM) reduces crosstalk between channels. Measured Bit Error Rate (BER) is lower than 10-12. Second, a 0.14pJ/b transceiver in 90nm CMOS is presented. A digital pulse shaping reduces the transmitter's energy dissipation to 0.11pJ/b. Device scaling reduces the receiver's energy dissipation to 0.03pJ/b. The overall energy dissipation is 20X lower than the first transceiver without degrading the data rate and BER.

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Inductive-coupling transceiver for 3D system integration

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