Inductive-coupling transceiver for 3D system integration

Noriyuki Miura, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    This paper presents recent achievements of a high-bandwidth and low-energy inductive-coupling transceiver. First, a lTb/s 2.8pJ/b transceiver in 180nm CMOS is presented. Both clock and data are transmitted by inductive coupling at a clock rate of 1GHz and a data rate of lGb/s. 1024 data transceivers are arranged with a pitch of 30μm in 1mm2 where 4-phase Time Division Multiplexing (TDM) reduces crosstalk between channels. Measured Bit Error Rate (BER) is lower than 10-12. Second, a 0.14pJ/b transceiver in 90nm CMOS is presented. A digital pulse shaping reduces the transmitter's energy dissipation to 0.11pJ/b. Device scaling reduces the receiver's energy dissipation to 0.03pJ/b. The overall energy dissipation is 20X lower than the first transceiver without degrading the data rate and BER.

    Original languageEnglish
    Title of host publicationProceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT
    Pages172-175
    Number of pages4
    DOIs
    Publication statusPublished - 2007 Dec 1
    Event2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT - Austin, TX, United States
    Duration: 2007 May 302007 Jun 1

    Publication series

    NameProceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT

    Other

    Other2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT
    CountryUnited States
    CityAustin, TX
    Period07/5/3007/6/1

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Fingerprint Dive into the research topics of 'Inductive-coupling transceiver for 3D system integration'. Together they form a unique fingerprint.

  • Cite this

    Miura, N., & Kuroda, T. (2007). Inductive-coupling transceiver for 3D system integration. In Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT (pp. 172-175). [4299566] (Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT). https://doi.org/10.1109/ICICDT.2007.4299566