Inductive coupling transceivers for inter-chip data communication

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

ThruChip Interface (TCI) employing inductive coupling bares comparison with TSV in performance with much inexpensive cost. It is available for production. For instance, Solid-State Drive (SSD) in a package can be realized by stacking NAND Flash memories. A high-speed low-power DRAM interface can be implemented. Extension of communication distance to millimeter ranges makes it possible to probe internal bus data through package for debugging and to perform non-contact wafer simultaneous testing. Wireless power delivery by using inductive coupling will further widen the applications. In this paper technology and applications of the TCI are presented.

Original languageEnglish
Title of host publication2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009
Pages13-15
Number of pages3
DOIs
Publication statusPublished - 2009
Event2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009 - Singapore, Singapore
Duration: 2009 Jan 92009 Jan 11

Other

Other2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009
CountrySingapore
CitySingapore
Period09/1/909/1/11

Fingerprint

Transceivers
Flash memory
Dynamic random access storage
Communication
Testing
Costs

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

Kuroda, T. (2009). Inductive coupling transceivers for inter-chip data communication. In 2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009 (pp. 13-15). [5383655] https://doi.org/10.1109/RFIT.2009.5383655

Inductive coupling transceivers for inter-chip data communication. / Kuroda, Tadahiro.

2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009. 2009. p. 13-15 5383655.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuroda, T 2009, Inductive coupling transceivers for inter-chip data communication. in 2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009., 5383655, pp. 13-15, 2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009, Singapore, Singapore, 09/1/9. https://doi.org/10.1109/RFIT.2009.5383655
Kuroda T. Inductive coupling transceivers for inter-chip data communication. In 2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009. 2009. p. 13-15. 5383655 https://doi.org/10.1109/RFIT.2009.5383655
Kuroda, Tadahiro. / Inductive coupling transceivers for inter-chip data communication. 2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009. 2009. pp. 13-15
@inproceedings{de8e32a8b563434496e4bf3f4daccefc,
title = "Inductive coupling transceivers for inter-chip data communication",
abstract = "ThruChip Interface (TCI) employing inductive coupling bares comparison with TSV in performance with much inexpensive cost. It is available for production. For instance, Solid-State Drive (SSD) in a package can be realized by stacking NAND Flash memories. A high-speed low-power DRAM interface can be implemented. Extension of communication distance to millimeter ranges makes it possible to probe internal bus data through package for debugging and to perform non-contact wafer simultaneous testing. Wireless power delivery by using inductive coupling will further widen the applications. In this paper technology and applications of the TCI are presented.",
author = "Tadahiro Kuroda",
year = "2009",
doi = "10.1109/RFIT.2009.5383655",
language = "English",
isbn = "9781424450312",
pages = "13--15",
booktitle = "2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009",

}

TY - GEN

T1 - Inductive coupling transceivers for inter-chip data communication

AU - Kuroda, Tadahiro

PY - 2009

Y1 - 2009

N2 - ThruChip Interface (TCI) employing inductive coupling bares comparison with TSV in performance with much inexpensive cost. It is available for production. For instance, Solid-State Drive (SSD) in a package can be realized by stacking NAND Flash memories. A high-speed low-power DRAM interface can be implemented. Extension of communication distance to millimeter ranges makes it possible to probe internal bus data through package for debugging and to perform non-contact wafer simultaneous testing. Wireless power delivery by using inductive coupling will further widen the applications. In this paper technology and applications of the TCI are presented.

AB - ThruChip Interface (TCI) employing inductive coupling bares comparison with TSV in performance with much inexpensive cost. It is available for production. For instance, Solid-State Drive (SSD) in a package can be realized by stacking NAND Flash memories. A high-speed low-power DRAM interface can be implemented. Extension of communication distance to millimeter ranges makes it possible to probe internal bus data through package for debugging and to perform non-contact wafer simultaneous testing. Wireless power delivery by using inductive coupling will further widen the applications. In this paper technology and applications of the TCI are presented.

UR - http://www.scopus.com/inward/record.url?scp=77951440972&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77951440972&partnerID=8YFLogxK

U2 - 10.1109/RFIT.2009.5383655

DO - 10.1109/RFIT.2009.5383655

M3 - Conference contribution

AN - SCOPUS:77951440972

SN - 9781424450312

SP - 13

EP - 15

BT - 2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009

ER -