Inductive coupling transceivers for inter-chip data communication

Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    ThruChip Interface (TCI) employing inductive coupling bares comparison with TSV in performance with much inexpensive cost. It is available for production. For instance, Solid-State Drive (SSD) in a package can be realized by stacking NAND Flash memories. A high-speed low-power DRAM interface can be implemented. Extension of communication distance to millimeter ranges makes it possible to probe internal bus data through package for debugging and to perform non-contact wafer simultaneous testing. Wireless power delivery by using inductive coupling will further widen the applications. In this paper technology and applications of the TCI are presented.

    Original languageEnglish
    Title of host publication2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009
    Pages13-15
    Number of pages3
    DOIs
    Publication statusPublished - 2009
    Event2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009 - Singapore, Singapore
    Duration: 2009 Jan 92009 Jan 11

    Publication series

    Name2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009

    Other

    Other2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009
    CountrySingapore
    CitySingapore
    Period09/1/909/1/11

    ASJC Scopus subject areas

    • Computer Networks and Communications
    • Electrical and Electronic Engineering

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  • Cite this

    Kuroda, T. (2009). Inductive coupling transceivers for inter-chip data communication. In 2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009 (pp. 13-15). [5383655] (2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009). https://doi.org/10.1109/RFIT.2009.5383655