TY - GEN
T1 - Inductively-powered wireless solid-state drive (SSD) system with merged error correction of high-speed non-contact data links and NAND flash memory
AU - Kosuge, Atsutake
AU - Hashiba, Junki
AU - Kawajiri, Toru
AU - Hasegawa, So
AU - Shidei, Tsunaaki
AU - Ishikuro, Hiroki
AU - Kuroda, Tadahiro
AU - Takeuchi, Ken
N1 - Publisher Copyright:
© 2015 JSAP.
PY - 2015/8/31
Y1 - 2015/8/31
N2 - This paper presents a wireless solid-state drive (SSD) system for future applications of large volume storage in mobile devices or data centers. The wireless interface in the developed system consists of an inductive-coupling power link with a fast transmitting power control and high-speed data links with transmission line couplers (TLCs). The wireless power link can deliver 1W from the host side to the SSD side. The full duplex wireless data interface achieved raw data rate of 1.6Gbps/link. The error correction block for NAND flash memory system can also correct the error in wireless data links. The data link has tolerance to the interference from the power link, and both the data and power links show the waterproof property of the system.
AB - This paper presents a wireless solid-state drive (SSD) system for future applications of large volume storage in mobile devices or data centers. The wireless interface in the developed system consists of an inductive-coupling power link with a fast transmitting power control and high-speed data links with transmission line couplers (TLCs). The wireless power link can deliver 1W from the host side to the SSD side. The full duplex wireless data interface achieved raw data rate of 1.6Gbps/link. The error correction block for NAND flash memory system can also correct the error in wireless data links. The data link has tolerance to the interference from the power link, and both the data and power links show the waterproof property of the system.
UR - http://www.scopus.com/inward/record.url?scp=84957894434&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84957894434&partnerID=8YFLogxK
U2 - 10.1109/VLSIC.2015.7231350
DO - 10.1109/VLSIC.2015.7231350
M3 - Conference contribution
AN - SCOPUS:84957894434
T3 - IEEE Symposium on VLSI Circuits, Digest of Technical Papers
SP - C128-C129
BT - 2015 Symposium on VLSI Circuits, VLSI Circuits 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th Annual Symposium on VLSI Circuits, VLSI Circuits 2015
Y2 - 17 June 2015 through 19 June 2015
ER -