TY - GEN
T1 - Integration of carbon nanotubes into via structures
AU - Awano, Yuji
PY - 2006/12/1
Y1 - 2006/12/1
N2 - Carbon nanotubes (CNTs) offer unique properties such as the highest current density exceeding 109 A/cm2, ultra-high thermal conductivity, ballistic transport along the tube and extremely high mechanical strength with high aspect ratio of the structure. Because of these remarkable properties, they have been expected for use as future wiring materials to solve several problems in future LSIs. In this paper, we demonstrate present status of CNT material technologies and the potential of metallic CNT via technology. In particular, we report our new approach to fabricating CNT via interconnects, where we use preformed catalyst nanoparticles to grow diameter-controlled CNTs at low temperature.
AB - Carbon nanotubes (CNTs) offer unique properties such as the highest current density exceeding 109 A/cm2, ultra-high thermal conductivity, ballistic transport along the tube and extremely high mechanical strength with high aspect ratio of the structure. Because of these remarkable properties, they have been expected for use as future wiring materials to solve several problems in future LSIs. In this paper, we demonstrate present status of CNT material technologies and the potential of metallic CNT via technology. In particular, we report our new approach to fabricating CNT via interconnects, where we use preformed catalyst nanoparticles to grow diameter-controlled CNTs at low temperature.
UR - http://www.scopus.com/inward/record.url?scp=33947259467&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33947259467&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:33947259467
SN - 1558999477
SN - 9781558999473
T3 - Advanced Metallization Conference (AMC)
SP - 253
EP - 261
BT - Advanced Metallization Conference 2006, AMC 2006
T2 - 23rd Annual Advanced Metallization Conference, AMC 2006
Y2 - 17 October 2006 through 19 October 2006
ER -