Integration of carbon nanotubes into via structures

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Carbon nanotubes (CNTs) offer unique properties such as the highest current density exceeding 109 A/cm2, ultra-high thermal conductivity, ballistic transport along the tube and extremely high mechanical strength with high aspect ratio of the structure. Because of these remarkable properties, they have been expected for use as future wiring materials to solve several problems in future LSIs. In this paper, we demonstrate present status of CNT material technologies and the potential of metallic CNT via technology. In particular, we report our new approach to fabricating CNT via interconnects, where we use preformed catalyst nanoparticles to grow diameter-controlled CNTs at low temperature.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference (AMC)
Number of pages9
Publication statusPublished - 2006
Externally publishedYes
Event23rd Annual Advanced Metallization Conference, AMC 2006 - San Diego, CA, United States
Duration: 2006 Oct 172006 Oct 19


Other23rd Annual Advanced Metallization Conference, AMC 2006
CountryUnited States
CitySan Diego, CA


ASJC Scopus subject areas

  • Chemical Engineering(all)

Cite this

Awano, Y. (2006). Integration of carbon nanotubes into via structures. In Advanced Metallization Conference (AMC) (Vol. 2006, pp. 253-261)