Interchannel pitch conversion (250 to 125 μm) in multimode polymer optical waveguide for high-density optical wiring

Hikaru Masuda, Takaaki Ishigure

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

We present a pitch conversion structure (250 - 125 μm pitch) in multimode polymer optical waveguides for high density interconnects, and investigate how to improve the coupling efficiency with a 12-ch. MMF ribbon.

Original languageEnglish
Title of host publicationIEEE CPMT Symposium Japan 2015: Packaging is Everywhere, ICSJ 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages41-44
Number of pages4
ISBN (Print)9781479988150
DOIs
Publication statusPublished - 2015 Dec 14
EventIEEE CPMT Symposium Japan 2015, ICSJ 2015 - Kyoto, Japan
Duration: 2015 Nov 92015 Nov 11

Other

OtherIEEE CPMT Symposium Japan 2015, ICSJ 2015
CountryJapan
CityKyoto
Period15/11/915/11/11

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Keywords

  • optoelectronics packaging & subsystems
  • pitch conversion
  • polymer ooptical waveguides

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Masuda, H., & Ishigure, T. (2015). Interchannel pitch conversion (250 to 125 μm) in multimode polymer optical waveguide for high-density optical wiring. In IEEE CPMT Symposium Japan 2015: Packaging is Everywhere, ICSJ 2015 (pp. 41-44). [7357355] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2015.7357355