Interchannel pitch conversion (250 to 125 μm) in multimode polymer optical waveguide for high-density optical wiring

Hikaru Masuda; Takaaki Ishigure

doi:10.1109/ICSJ.2015.7357355

Interchannel pitch conversion (250 to 125 μm) in multimode polymer optical waveguide for high-density optical wiring

Hikaru Masuda, Takaaki Ishigure

Department of Applied Physics and Physico-Informatics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

We present a pitch conversion structure (250 - 125 μm pitch) in multimode polymer optical waveguides for high density interconnects, and investigate how to improve the coupling efficiency with a 12-ch. MMF ribbon.

Original language	English
Title of host publication	IEEE CPMT Symposium Japan 2015: Packaging is Everywhere, ICSJ 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	41-44
Number of pages	4
ISBN (Print)	9781479988150
DOIs	https://doi.org/10.1109/ICSJ.2015.7357355
Publication status	Published - 2015 Dec 14
Event	IEEE CPMT Symposium Japan 2015, ICSJ 2015 - Kyoto, Japan Duration: 2015 Nov 9 → 2015 Nov 11

Other

Other	IEEE CPMT Symposium Japan 2015, ICSJ 2015
Country/Territory	Japan
City	Kyoto
Period	15/11/9 → 15/11/11

Keywords

optoelectronics packaging & subsystems
pitch conversion
polymer ooptical waveguides

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ICSJ.2015.7357355

Cite this

Interchannel pitch conversion (250 to 125 μm) in multimode polymer optical waveguide for high-density optical wiring. / Masuda, Hikaru; Ishigure, Takaaki.
IEEE CPMT Symposium Japan 2015: Packaging is Everywhere, ICSJ 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 41-44 7357355.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Masuda, H & Ishigure, T 2015, Interchannel pitch conversion (250 to 125 μm) in multimode polymer optical waveguide for high-density optical wiring. in IEEE CPMT Symposium Japan 2015: Packaging is Everywhere, ICSJ 2015., 7357355, Institute of Electrical and Electronics Engineers Inc., pp. 41-44, IEEE CPMT Symposium Japan 2015, ICSJ 2015, Kyoto, Japan, 15/11/9. https://doi.org/10.1109/ICSJ.2015.7357355

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abstract = "We present a pitch conversion structure (250 - 125 μm pitch) in multimode polymer optical waveguides for high density interconnects, and investigate how to improve the coupling efficiency with a 12-ch. MMF ribbon.",

keywords = "optoelectronics packaging & subsystems, pitch conversion, polymer ooptical waveguides",

author = "Hikaru Masuda and Takaaki Ishigure",

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N2 - We present a pitch conversion structure (250 - 125 μm pitch) in multimode polymer optical waveguides for high density interconnects, and investigate how to improve the coupling efficiency with a 12-ch. MMF ribbon.

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ER -

Interchannel pitch conversion (250 to 125 μm) in multimode polymer optical waveguide for high-density optical wiring

Abstract

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Keywords

ASJC Scopus subject areas

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