Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages

Nobuyuki Shishido; Satoru Matsumoto; Chuantong Chen; Hisashi Sato; Masaki Omiya; Shoji Kamiya; Masahiro Nishida; Takeshi Nokuo; Tadahiro Nagasawa; Takashi Suzuki; Tomoji Nakamura

doi:10.1115/IPACK2011-52270

Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages

Nobuyuki Shishido, Satoru Matsumoto, Chuantong Chen, Hisashi Sato, Masaki Omiya, Shoji Kamiya, Masahiro Nishida, Takeshi Nokuo, Tadahiro Nagasawa, Takashi Suzuki, Tomoji Nakamura

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Capability of detecting local interface strength variation with 10 μm scale resolution was investigated in reference to the interface between vapor-deposited gold (Au) and SiO₂ with a practically homogeneous strength. Uncertainties in the evaluation procedure were thoroughly examined, which was to be excluded from the apparent scatter of evaluation results. The intrinsic scatter of strength in a damascene Cu/SiN cap interface was successfully specified to be at least 2.45 J/m².

Original language	English
Title of host publication	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
DOIs	https://doi.org/10.1115/IPACK2011-52270
Publication status	Published - 2011 Dec 1
Event	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States Duration: 2011 Jul 6 → 2011 Jul 8

Publication series

Name	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume	1

Other

Other	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Country/Territory	United States
City	Portland, OR
Period	11/7/6 → 11/7/8

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.1115/IPACK2011-52270

Cite this

Shishido, N., Matsumoto, S., Chen, C., Sato, H., Omiya, M., Kamiya, S., Nishida, M., Nokuo, T., Nagasawa, T., Suzuki, T., & Nakamura, T. (2011). Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 1). https://doi.org/10.1115/IPACK2011-52270

Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. / Shishido, Nobuyuki; Matsumoto, Satoru; Chen, Chuantong et al.

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shishido, N, Matsumoto, S, Chen, C, Sato, H, Omiya, M, Kamiya, S, Nishida, M, Nokuo, T, Nagasawa, T, Suzuki, T & Nakamura, T 2011, Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. in ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, vol. 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, Portland, OR, United States, 11/7/6. https://doi.org/10.1115/IPACK2011-52270

Shishido N, Matsumoto S, Chen C, Sato H, Omiya M, Kamiya S et al. Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011). doi: 10.1115/IPACK2011-52270

Shishido, Nobuyuki ; Matsumoto, Satoru ; Chen, Chuantong et al. / Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011).

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abstract = "Capability of detecting local interface strength variation with 10 μm scale resolution was investigated in reference to the interface between vapor-deposited gold (Au) and SiO2 with a practically homogeneous strength. Uncertainties in the evaluation procedure were thoroughly examined, which was to be excluded from the apparent scatter of evaluation results. The intrinsic scatter of strength in a damascene Cu/SiN cap interface was successfully specified to be at least 2.45 J/m2.",

author = "Nobuyuki Shishido and Satoru Matsumoto and Chuantong Chen and Hisashi Sato and Masaki Omiya and Shoji Kamiya and Masahiro Nishida and Takeshi Nokuo and Tadahiro Nagasawa and Takashi Suzuki and Tomoji Nakamura",

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AU - Shishido, Nobuyuki

AU - Matsumoto, Satoru

AU - Chen, Chuantong

AU - Sato, Hisashi

AU - Omiya, Masaki

AU - Kamiya, Shoji

AU - Nishida, Masahiro

AU - Nokuo, Takeshi

AU - Nagasawa, Tadahiro

AU - Suzuki, Takashi

AU - Nakamura, Tomoji

PY - 2011/12/1

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N2 - Capability of detecting local interface strength variation with 10 μm scale resolution was investigated in reference to the interface between vapor-deposited gold (Au) and SiO2 with a practically homogeneous strength. Uncertainties in the evaluation procedure were thoroughly examined, which was to be excluded from the apparent scatter of evaluation results. The intrinsic scatter of strength in a damascene Cu/SiN cap interface was successfully specified to be at least 2.45 J/m2.

AB - Capability of detecting local interface strength variation with 10 μm scale resolution was investigated in reference to the interface between vapor-deposited gold (Au) and SiO2 with a practically homogeneous strength. Uncertainties in the evaluation procedure were thoroughly examined, which was to be excluded from the apparent scatter of evaluation results. The intrinsic scatter of strength in a damascene Cu/SiN cap interface was successfully specified to be at least 2.45 J/m2.

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BT - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

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Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages

Abstract

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