Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages

Nobuyuki Shishido, Satoru Matsumoto, Chuantong Chen, Hisashi Sato, Masaki Omiya, Shoji Kamiya, Masahiro Nishida, Takeshi Nokuo, Tadahiro Nagasawa, Takashi Suzuki, Tomoji Nakamura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Capability of detecting local interface strength variation with 10 μm scale resolution was investigated in reference to the interface between vapor-deposited gold (Au) and SiO2 with a practically homogeneous strength. Uncertainties in the evaluation procedure were thoroughly examined, which was to be excluded from the apparent scatter of evaluation results. The intrinsic scatter of strength in a damascene Cu/SiN cap interface was successfully specified to be at least 2.45 J/m2.

Original languageEnglish
Title of host publicationASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume1
DOIs
Publication statusPublished - 2011
EventASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States
Duration: 2011 Jul 62011 Jul 8

Other

OtherASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
CountryUnited States
CityPortland, OR
Period11/7/611/7/8

Fingerprint

Focused ion beams
Toughness
Gold
Vapors
Uncertainty

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Shishido, N., Matsumoto, S., Chen, C., Sato, H., Omiya, M., Kamiya, S., ... Nakamura, T. (2011). Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (Vol. 1) https://doi.org/10.1115/IPACK2011-52270

Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. / Shishido, Nobuyuki; Matsumoto, Satoru; Chen, Chuantong; Sato, Hisashi; Omiya, Masaki; Kamiya, Shoji; Nishida, Masahiro; Nokuo, Takeshi; Nagasawa, Tadahiro; Suzuki, Takashi; Nakamura, Tomoji.

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 1 2011.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shishido, N, Matsumoto, S, Chen, C, Sato, H, Omiya, M, Kamiya, S, Nishida, M, Nokuo, T, Nagasawa, T, Suzuki, T & Nakamura, T 2011, Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. in ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. vol. 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, Portland, OR, United States, 11/7/6. https://doi.org/10.1115/IPACK2011-52270
Shishido N, Matsumoto S, Chen C, Sato H, Omiya M, Kamiya S et al. Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 1. 2011 https://doi.org/10.1115/IPACK2011-52270
Shishido, Nobuyuki ; Matsumoto, Satoru ; Chen, Chuantong ; Sato, Hisashi ; Omiya, Masaki ; Kamiya, Shoji ; Nishida, Masahiro ; Nokuo, Takeshi ; Nagasawa, Tadahiro ; Suzuki, Takashi ; Nakamura, Tomoji. / Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 1 2011.
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