Jumping force of coalescing droplets on a superhydrophobic surface

T. V. Nguyen, T. Mouterde, Hidetoshi Takahashi, D. Quéré, I. Shimoyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

We report a method to directly measure the jumping force during the coalescence of two water droplets on a superhydrophobic surface using a MEMS-based force sensor as shown in Figure 1(a). The sensor is designed to measure the jumping force during the coalescence of two droplets whose radii are several hundred μm. The measurement results show that the maximum jumping force could be more than 10 times larger than the total weight of the merged droplet. Moreover, the impulse calculated from the measured force was on the same order with the jumping momentum of the droplet. Therefore, our sensor is a useful tool to investigate the mechanism of coalescence-induced droplet jumping.

Original languageEnglish
Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages95-98
Number of pages4
ISBN (Electronic)9781509050789
DOIs
Publication statusPublished - 2017 Feb 23
Externally publishedYes
Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
Duration: 2017 Jan 222017 Jan 26

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
CountryUnited States
CityLas Vegas
Period17/1/2217/1/26

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Nguyen, T. V., Mouterde, T., Takahashi, H., Quéré, D., & Shimoyama, I. (2017). Jumping force of coalescing droplets on a superhydrophobic surface. In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 95-98). [7863348] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863348