Laser micro-Raman spectroscopy of single-point diamond machined silicon substrates

Research output: Contribution to journalArticle

65 Citations (Scopus)

Abstract

Due to its hard and brittle nature, silicon is currently finished by lapping and chemomechanical polishing (CMP). However, silicon can be plastically deformed in a ductile manner in ultraprecision machining at an extremely smooth surfaces. Using the ductile machining technology, the productivity of aspherical, diffractive optical components, and large-diameter substrates for recent microelectronic mechanical system (MEMS) applications can be significantly improved.

Original languageEnglish
Pages (from-to)2094-2101
Number of pages8
JournalJournal of Applied Physics
Volume95
Issue number4
DOIs
Publication statusPublished - 2004 Feb 15
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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