Laser micro-Raman spectroscopy of single-point diamond machined silicon substrates

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65 Citations (Scopus)

Abstract

Due to its hard and brittle nature, silicon is currently finished by lapping and chemomechanical polishing (CMP). However, silicon can be plastically deformed in a ductile manner in ultraprecision machining at an extremely smooth surfaces. Using the ductile machining technology, the productivity of aspherical, diffractive optical components, and large-diameter substrates for recent microelectronic mechanical system (MEMS) applications can be significantly improved.

Original languageEnglish
Pages (from-to)2094-2101
Number of pages8
JournalJournal of Applied Physics
Volume95
Issue number4
DOIs
Publication statusPublished - 2004 Feb 15
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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