Laser recovery of machining damage under curved silicon surface

Jiwang Yan, Fuminori Kobayashi

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

Nano-second pulsed laser irradiation was used to recover machining-induced damage under curved surfaces of single-crystal silicon. Microstructural changes of silicon due to laser irradiation were characterized by cross-sectional transmission electron microscopy and laser micro-Raman spectroscopy. The recoverable damage depth was predicted by finite element modeling of laser-induced temperature change in the workpiece material. Slanted irradiation experiments were performed and the critical surface inclination angle for complete recovery was experimentally obtained. The results demonstrate that atomic-level subsurface integrity and nanometric surface roughness can be achieved on large-curvature silicon surfaces, such as the surfaces of toroidally shaped wafer edges.

Original languageEnglish
Pages (from-to)199-202
Number of pages4
JournalCIRP Annals - Manufacturing Technology
Volume62
Issue number1
DOIs
Publication statusPublished - 2013

Fingerprint

Machining
Recovery
Silicon
Lasers
Laser beam effects
Pulsed lasers
Raman spectroscopy
Surface roughness
Irradiation
Single crystals
Transmission electron microscopy
Experiments
Temperature

Keywords

  • Laser recovery
  • Single crystal
  • Surface integrity

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

Cite this

Laser recovery of machining damage under curved silicon surface. / Yan, Jiwang; Kobayashi, Fuminori.

In: CIRP Annals - Manufacturing Technology, Vol. 62, No. 1, 2013, p. 199-202.

Research output: Contribution to journalArticle

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