TY - GEN
T1 - Lig-Based Triaxial Tactile Sensor Utilizing Rotational Erection System
AU - Nakashima, Rihachiro
AU - Nakamura, Nagi
AU - Sano, Tomohiko G.
AU - Iwase, Eiji
AU - Takahashi, Hidetoshi
N1 - Funding Information:
This work was partially supported by JSPS KAKENHI Grant numbers JP22K18421 and JP21H01274, The Takano Science Foundation, and Amada Foundation.
Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper reports a laser-induced graphene (LIG)based triaxial tactile sensor utilizing rotational erection system (RES). The proposed process realizes a sensing element with a piezoresistive layer by irradiating a polyimide (PI) film with two types of lasers only once each. Furthermore, the sensing element formed with origami/kirigami method maintains a three-dimensional structure by applying a single external force. The prototype triaxial tactile sensor fabricated by the proposed fabrication process responded independently to normal and shear forces.
AB - This paper reports a laser-induced graphene (LIG)based triaxial tactile sensor utilizing rotational erection system (RES). The proposed process realizes a sensing element with a piezoresistive layer by irradiating a polyimide (PI) film with two types of lasers only once each. Furthermore, the sensing element formed with origami/kirigami method maintains a three-dimensional structure by applying a single external force. The prototype triaxial tactile sensor fabricated by the proposed fabrication process responded independently to normal and shear forces.
KW - Laser-induced graphene
KW - Rotational erection system
KW - Triaxial tactile sensor
UR - http://www.scopus.com/inward/record.url?scp=85149873011&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85149873011&partnerID=8YFLogxK
U2 - 10.1109/MEMS49605.2023.10052413
DO - 10.1109/MEMS49605.2023.10052413
M3 - Conference contribution
AN - SCOPUS:85149873011
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 221
EP - 224
BT - 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023
Y2 - 15 January 2023 through 19 January 2023
ER -