Liquid encapsulation by Bonding-in-Liquid Technique

Yoshiyuki Okayama, Keijiro Nakahara, Takeshi Ninomiya, Yasuaki Matsumoto, Norihisa Miki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We propose and demonstrate Bonding-in-Liquid Technique (BiLT) for encapsulation of liquid in MEMS devices. Liquid encapsulation enables innovative MEMS devices with various functions. Interfusion of air bubbles, heterogeneity of the liquid quantity, and leakage of the encapsulated liquid must be averted not to deteriorate device performances. In BiLT, two structural layers are passively aligned and brought into contact in solution, where the encapsulation cavities are uniformly filled up with the liquid without air bubbles. A UV-curable resin is used as an adhesive that does not require heat or vacuum environment but UV to bond the two layers. We successfully achieved encapsulation of DI water and glycerin in silicon structural layers. Since conventional aligners are not applicable to BiLT, we experimentally evaluated the accuracy of the passive alignment process in solution that makes use of matching concave and convex structures.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium Proceedings
Pages197-202
Number of pages6
Volume1222
Publication statusPublished - 2010
Event2009 MRS Fall Meeting - Boston, MA, United States
Duration: 2009 Nov 302009 Dec 2

Other

Other2009 MRS Fall Meeting
CountryUnited States
CityBoston, MA
Period09/11/3009/12/2

Fingerprint

Encapsulation
Liquids
liquids
microelectromechanical systems
Bubbles (in fluids)
MEMS
bubbles
liquid air
Leakage (fluid)
Silicon
resins
adhesives
Air
Glycerol
Contacts (fluid mechanics)
leakage
alignment
Adhesives
Resins
heat

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Okayama, Y., Nakahara, K., Ninomiya, T., Matsumoto, Y., & Miki, N. (2010). Liquid encapsulation by Bonding-in-Liquid Technique. In Materials Research Society Symposium Proceedings (Vol. 1222, pp. 197-202)

Liquid encapsulation by Bonding-in-Liquid Technique. / Okayama, Yoshiyuki; Nakahara, Keijiro; Ninomiya, Takeshi; Matsumoto, Yasuaki; Miki, Norihisa.

Materials Research Society Symposium Proceedings. Vol. 1222 2010. p. 197-202.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Okayama, Y, Nakahara, K, Ninomiya, T, Matsumoto, Y & Miki, N 2010, Liquid encapsulation by Bonding-in-Liquid Technique. in Materials Research Society Symposium Proceedings. vol. 1222, pp. 197-202, 2009 MRS Fall Meeting, Boston, MA, United States, 09/11/30.
Okayama Y, Nakahara K, Ninomiya T, Matsumoto Y, Miki N. Liquid encapsulation by Bonding-in-Liquid Technique. In Materials Research Society Symposium Proceedings. Vol. 1222. 2010. p. 197-202
Okayama, Yoshiyuki ; Nakahara, Keijiro ; Ninomiya, Takeshi ; Matsumoto, Yasuaki ; Miki, Norihisa. / Liquid encapsulation by Bonding-in-Liquid Technique. Materials Research Society Symposium Proceedings. Vol. 1222 2010. pp. 197-202
@inproceedings{5de58ad4908644bba7350caf965c32f9,
title = "Liquid encapsulation by Bonding-in-Liquid Technique",
abstract = "We propose and demonstrate Bonding-in-Liquid Technique (BiLT) for encapsulation of liquid in MEMS devices. Liquid encapsulation enables innovative MEMS devices with various functions. Interfusion of air bubbles, heterogeneity of the liquid quantity, and leakage of the encapsulated liquid must be averted not to deteriorate device performances. In BiLT, two structural layers are passively aligned and brought into contact in solution, where the encapsulation cavities are uniformly filled up with the liquid without air bubbles. A UV-curable resin is used as an adhesive that does not require heat or vacuum environment but UV to bond the two layers. We successfully achieved encapsulation of DI water and glycerin in silicon structural layers. Since conventional aligners are not applicable to BiLT, we experimentally evaluated the accuracy of the passive alignment process in solution that makes use of matching concave and convex structures.",
author = "Yoshiyuki Okayama and Keijiro Nakahara and Takeshi Ninomiya and Yasuaki Matsumoto and Norihisa Miki",
year = "2010",
language = "English",
isbn = "9781605111957",
volume = "1222",
pages = "197--202",
booktitle = "Materials Research Society Symposium Proceedings",

}

TY - GEN

T1 - Liquid encapsulation by Bonding-in-Liquid Technique

AU - Okayama, Yoshiyuki

AU - Nakahara, Keijiro

AU - Ninomiya, Takeshi

AU - Matsumoto, Yasuaki

AU - Miki, Norihisa

PY - 2010

Y1 - 2010

N2 - We propose and demonstrate Bonding-in-Liquid Technique (BiLT) for encapsulation of liquid in MEMS devices. Liquid encapsulation enables innovative MEMS devices with various functions. Interfusion of air bubbles, heterogeneity of the liquid quantity, and leakage of the encapsulated liquid must be averted not to deteriorate device performances. In BiLT, two structural layers are passively aligned and brought into contact in solution, where the encapsulation cavities are uniformly filled up with the liquid without air bubbles. A UV-curable resin is used as an adhesive that does not require heat or vacuum environment but UV to bond the two layers. We successfully achieved encapsulation of DI water and glycerin in silicon structural layers. Since conventional aligners are not applicable to BiLT, we experimentally evaluated the accuracy of the passive alignment process in solution that makes use of matching concave and convex structures.

AB - We propose and demonstrate Bonding-in-Liquid Technique (BiLT) for encapsulation of liquid in MEMS devices. Liquid encapsulation enables innovative MEMS devices with various functions. Interfusion of air bubbles, heterogeneity of the liquid quantity, and leakage of the encapsulated liquid must be averted not to deteriorate device performances. In BiLT, two structural layers are passively aligned and brought into contact in solution, where the encapsulation cavities are uniformly filled up with the liquid without air bubbles. A UV-curable resin is used as an adhesive that does not require heat or vacuum environment but UV to bond the two layers. We successfully achieved encapsulation of DI water and glycerin in silicon structural layers. Since conventional aligners are not applicable to BiLT, we experimentally evaluated the accuracy of the passive alignment process in solution that makes use of matching concave and convex structures.

UR - http://www.scopus.com/inward/record.url?scp=77955945506&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77955945506&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:77955945506

SN - 9781605111957

VL - 1222

SP - 197

EP - 202

BT - Materials Research Society Symposium Proceedings

ER -