Liquid encapsulation by Bonding-in-Liquid Technique

Yoshiyuki Okayama, Keijiro Nakahara, Takeshi Ninomiya, Yasuaki Matsumoto, Norihisa Miki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We propose and demonstrate Bonding-in-Liquid Technique (BiLT) for encapsulation of liquid in MEMS devices. Liquid encapsulation enables innovative MEMS devices with various functions. Interfusion of air bubbles, heterogeneity of the liquid quantity, and leakage of the encapsulated liquid must be averted not to deteriorate device performances. In BiLT, two structural layers are passively aligned and brought into contact in solution, where the encapsulation cavities are uniformly filled up with the liquid without air bubbles. A UV-curable resin is used as an adhesive that does not require heat or vacuum environment but UV to bond the two layers. We successfully achieved encapsulation of DI water and glycerin in silicon structural layers. Since conventional aligners are not applicable to BiLT, we experimentally evaluated the accuracy of the passive alignment process in solution that makes use of matching concave and convex structures.

Original languageEnglish
Title of host publicationMicroelectromechanical Systems - Materials and Devices III
Pages197-202
Number of pages6
Publication statusPublished - 2010 Aug 30
Event2009 MRS Fall Meeting - Boston, MA, United States
Duration: 2009 Nov 302009 Dec 4

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1222
ISSN (Print)0272-9172

Other

Other2009 MRS Fall Meeting
CountryUnited States
CityBoston, MA
Period09/11/3009/12/4

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Okayama, Y., Nakahara, K., Ninomiya, T., Matsumoto, Y., & Miki, N. (2010). Liquid encapsulation by Bonding-in-Liquid Technique. In Microelectromechanical Systems - Materials and Devices III (pp. 197-202). (Materials Research Society Symposium Proceedings; Vol. 1222).